Femtosecond pulse interactions with quantum dots for ultra-fast optoelectronic devices
femtosecond lasers
quantum dots
optoelectronics
photonic devices
ultrafast spectroscopy
Through back-end-of-line thermal management in 3nm chiplet architectures
BEOL thermal management
3nm technology
chiplet cooling
semiconductor packaging
microfluidic heat sinks
Preparing for 2032 processor nodes using carbon nanotube vias
carbon nanotubes
processor nodes
semiconductor scaling
interconnects
Moore's Law
Advancing quantum computing via directed self-assembly of block copolymers
quantum computing
block copolymers
self-assembly
qubits
nanotechnology
Employing germanium-silicon strain engineering for high-efficiency thermoelectric materials
germanium-silicon
strain engineering
thermoelectric materials
band structure
nanocomposites
Employing silicon photonics co-integration for ultra-low-power quantum computing interfaces
silicon photonics
quantum computing
energy efficiency
photonic integration
scalable architectures
Mitigating EUV mask defects for sub-3nm semiconductor manufacturing processes
EUV lithography
semiconductor manufacturing
mask defects
nanotechnology
chip fabrication
Optimizing backside power delivery networks for 3D integrated circuits
power delivery
3D integration
parasitic capacitance
thermal management
IC design
Backside power delivery networks for 3D integrated circuits with reduced parasitic losses
power delivery networks
3D ICs
parasitic capacitance
semiconductor design
energy efficiency
Through back-end-of-line thermal management for next-gen 3D chip stacking
3D IC cooling
thermal management
chip stacking
semiconductor packaging
heat dissipation
Via self-assembled monolayer doping for atomically precise semiconductor fabrication
monolayer doping
semiconductor fabrication
atomic precision
self-assembly
nanoelectronics
Through back-end-of-line thermal management in 2nm chip architectures using graphene heat spreaders
BEOL thermal management
2nm chips
graphene heat spreaders
semiconductor cooling
nanoelectronics