Advanced semiconductor and nanotechnology development

Via directed self-assembly of block copolymers, can we achieve sub-5nm semiconductor patterning?

block copolymers self-assembly semiconductor patterning nanofabrication lithography

Via self-assembled monolayer doping for ultra-efficient semiconductor devices

monolayer doping semiconductors nanotechnology energy efficiency material science

At terahertz oscillation frequencies for next-generation wireless communication beyond 6G networks

terahertz waves 6G networks wireless communication photonics semiconductor devices

Via computational lithography optimizations for 3D stacked chiplet integration

EUV patterning overlay error inverse design photoresist modeling heterogeneous integration

Atomic layer etching techniques for defect reduction in 2nm semiconductor node fabrication

atomic layer etching 2nm nodes semiconductor defects chip fabrication nanomanufacturing

EUV mask defect mitigation using reaction prediction transformers in semiconductor lithography

EUV lithography mask defects reaction prediction transformers semiconductor fabrication

Backside power delivery networks for 22nd century energy-efficient computing architectures

backside power delivery energy-efficient computing 3D ICs power networks semiconductor design

Directed self-assembly of block copolymers for sub-5nm semiconductor patterning via microwave-assisted synthesis

directed self-assembly block copolymers semiconductor patterning microwave synthesis nanofabrication

Through EUV mask defect mitigation in next-generation semiconductor manufacturing

EUV lithography mask defects semiconductor manufacturing nanofabrication chip scaling

Enhancing quantum dot performance via atomic precision defect engineering in semiconductor lattices

quantum dots defect engineering semiconductors optoelectronics atomic precision

Enhancing semiconductor performance via self-assembled monolayer doping with atomic precision

self-assembled monolayers semiconductor doping atomic precision nanoscale electronics charge transport

Through hybrid bonding for chiplet integration in next-gen semiconductor packaging

hybrid bonding chiplets 3D integration semiconductor packaging interconnect density