Atomfair 6-inch GaN-on-Si HEMT Epitaxial Wafer Silicon (Si) 6 inch Lattice Mismatch 16.90% Thermal Expansion Difference 56% 1×10 9/cm2

Silicon has long been a key semiconductor for most electronic applications, yet it is less efficient than silicon carbide (SiC) wafers. Now adopted in diverse uses-especially electric vehicles-SiC wafers address energy and cost challenges in developing high-efficiency, high-power devices. Composed of pure silicon and carbon, they outperform silicon in three key aspects: higher critical avalanche breakdown field, greater thermal conductivity, and wider bandgap (3eV). They withstand 8x higher voltage gradients than silicon, have lower high-temperature leakage current, higher current density, thinner structures (1/10 the thickness of silicon epitaxial layers), and lower conduction loss (7x higher doping concentration than silicon).

Description

Specifications
Substrate Material Silicon (Si)
Diameter 6 inch
Lattice Mismatch 16.90%
Thermal Expansion Difference 56%
Defect Density 1×109/cm2
Leakage Current High
Integration Potential High

Largest diameter option for GaN-on-Si with maximum process compatibility and integration potential.