Quantum computing and next-generation electronics

Through 3D monolithic integration of photonic and electronic circuits for terahertz communication

silicon photonics heterogeneous integration optical interconnects THz technology chip-scale packaging

Harnessing topological insulators for low-energy spintronic memory devices

topological insulators spintronics memory devices energy efficiency quantum materials

Through back-end-of-line thermal management in 3D integrated circuits for next-gen computing

thermal management 3D ICs semiconductors heat dissipation electronics

3D monolithic integration of photonic and electronic circuits for terahertz computing

monolithic integration photonic computing terahertz gap 3D chip stacking hybrid circuits

Optimizing hybrid bonding techniques for chiplet integration in advanced 3D monolithic systems

hybrid bonding chiplet integration 3D monolithic advanced packaging semiconductor scaling

Optimizing 3D monolithic integration for next-generation AI accelerator chips

heterogeneous integration wafer bonding deep learning accelerators thermal management TSV interconnects

At terahertz oscillation frequencies for next-generation wireless communication chips

terahertz technology wireless communication semiconductor design high-frequency electronics 6G networks

Optimizing gate-all-around nanosheet transistors for sub-3nm node performance

nanosheet transistors sub-3nm node semiconductor scaling power efficiency FinFET alternatives

Quantum coherence control in single-molecule systems for next-gen molecular electronics

single-molecule systems quantum coherence molecular electronics quantum control nanoscale devices

Atomic layer etching for sub-2nm semiconductor nodes with minimal defect propagation

atomic layer etching semiconductor fabrication 2nm nodes defect control Moore's Law

Preparing for 2032 processor nodes using 3D monolithic integration techniques

processor nodes 3D integration Moore's Law semiconductor scaling monolithic stacking

Bridging current and next-gen AI via hybrid bonding for chiplet integration

hybrid bonding chiplet integration AI hardware next-gen computing semiconductor technology