Through back-end-of-line thermal management in 2nm chip architectures using graphene heat spreaders
BEOL thermal management
2nm chips
graphene heat spreaders
semiconductor cooling
nanoelectronics
Controlling spin currents with topological insulators for low-energy spintronic devices
topological insulators
spintronics
spin currents
energy-efficient computing
quantum materials
Preparing for 2032 processor nodes with advanced lithography techniques
lithography
semiconductor
transistor scaling
EUV
chip fabrication
3D monolithic integration of photonic and electronic circuits for terahertz processors
3D integration
photonics
terahertz
monolithic circuits
processor design