Employing germanium-silicon strain engineering for high-performance quantum dot solar cells
strain engineering
quantum dots
photovoltaics
germanium-silicon
heterostructures
Using hydrogen storage metal-organic frameworks for grid-scale renewable energy buffering
metal-organic frameworks
hydrogen storage
renewable energy
grid stability
adsorption kinetics
Designing biodegradable electronics with 50-year durability requirements for sustainable tech
biodegradable electronics
sustainable technology
durability testing
eco-friendly materials
long-term performance
Spanning tectonic plate movements to predict deep-earth mineral deposits
tectonic plates
mineral exploration
rare-earth elements
geodynamic modeling
resource prediction
Optimizing spacecraft design with nuclear thermal propulsion for Mars missions in the 2030s
nuclear propulsion
Mars mission
spacecraft design
thrust efficiency
reactor safety
Probing spin relaxation timescales in quantum dots for fault-tolerant qubit design
spin relaxation
quantum dots
qubit stability
coherence times
semiconductor qubits
Preparing for 2032 processor nodes with back-end-of-line thermal management innovations
semiconductor scaling
thermal management
processor nodes
heat dissipation
2032 technology
Optimizing hydrogen storage efficiency using metal-organic frameworks with high surface area
hydrogen storage
metal-organic frameworks
adsorption
clean energy
porous materials
With in-situ water ice utilization for self-sustaining lunar agriculture systems
lunar agriculture
in-situ resource utilization
water ice
space farming
bioregenerative systems
Optimizing nanoscale mixing for efficient catalytic conversion in picocubic reaction chambers
nanoscale mixing
picocubic chambers
catalytic conversion
fluid dynamics
reaction efficiency
Via backside power delivery networks for 3D integrated circuit performance optimization
3D ICs
power delivery networks
semiconductor design
backside power
chip scaling
Through back-end-of-line thermal management in advanced 3D integrated circuits
thermal interfaces
3D ICs
heat dissipation
BEOL
electrothermal coupling