Quantum computing and next-generation electronics

Developing ruthenium-based interconnects for next-generation semiconductor devices

ruthenium interconnects semiconductor scaling thermal conductivity chip design Moore’s Law

Scalable nanofabrication via directed self-assembly of block copolymers for next-gen electronics

nanofabrication block copolymers directed self-assembly semiconductor nanotechnology

Using topological insulators for high-efficiency spintronics in next-gen computing

topological insulators spintronics quantum computing energy-efficient electronics spin-orbit coupling

Preparing for 2032 processor nodes with novel semiconductor materials and architectures

semiconductor materials processor nodes Moore's Law advanced architectures 2032 technology

Uniting glacier physics with semiconductor design for cryogenic computing

glacier physics cryogenic computing semiconductor design heat dissipation interdisciplinary engineering

With ferroelectric hafnium oxide: enabling ultra-low-power non-volatile memory devices

ferroelectric hafnium oxide non-volatile memory energy-efficient computing novel materials electronics innovation

Femtosecond pulse interactions with 2D materials for ultrafast optoelectronics

femtosecond lasers 2D materials optoelectronics ultrafast phenomena photonics

Optimizing hybrid bonding techniques for chiplet integration in next-gen processors

hybrid bonding chiplet integration interconnects 3D packaging semiconductor scaling

Using topological insulators for low-power spintronic memory devices

topological insulators spintronics memory devices energy efficiency quantum materials

Exploring hybrid bonding techniques for scalable chiplet integration in next-gen computing

hybrid bonding chiplet integration 3D packaging semiconductor manufacturing interconnect technology

Atomic layer etching optimization for defect-free 2nm semiconductor node fabrication

semiconductor manufacturing atomic precision plasma etching Moore's Law nanofabrication

3D monolithic integration of patent-expired innovations in electronics

monolithic integration expired patents 3D electronics semiconductor innovation cost-effective manufacturing