Advanced semiconductor and nanotechnology development

Through hybrid bonding for chiplet integration in next-gen quantum computers

hybrid bonding quantum chiplets semiconductor integration scalable computing nanofabrication

Preparing for 2032 processor nodes with 2025 cost reduction targets in semiconductor fabrication

semiconductor scaling cost reduction processor nodes Moore's Law fab economics

With transition metal dichalcogenide channels for ultra-low-power electronics

TMDs nanoelectronics energy-efficient devices 2D materials semiconductor physics

Uniting glacier physics with semiconductor design for cryogenic computing architectures

glacier physics cryogenic computing quantum heat transfer superconducting circuits analog modeling

Through smart metrology integration in atomic-scale semiconductor fabrication

smart metrology semiconductor fabrication atomic-scale manufacturing process control nanoelectronics

Uniting glacier physics with semiconductor design for novel thermal management

glacier dynamics semiconductor cooling thermal conductivity biomimicry materials science

Through hybrid bonding for chiplet integration in next-gen computing

hybrid bonding chiplet integration semiconductor high-performance computing advanced packaging

Using gate-all-around nanosheet transistors for sub-3nm logic node scaling

gate-all-around transistors nanosheet FETs semiconductor scaling logic devices Moore's Law

Through back-end-of-line thermal management for next-generation semiconductor devices

thermal management semiconductor cooling BEOL integration nanoscale heat transfer chip reliability

Employing germanium-silicon strain engineering for ultra-low-power quantum computing

quantum computing strain engineering germanium-silicon low-power electronics heterostructures

Through 3D monolithic integration of photonic and electronic circuits for terahertz communication

silicon photonics heterogeneous integration optical interconnects THz technology chip-scale packaging

Using atomic layer etching for 2nm nodes in semiconductor manufacturing

atomic layer etching semiconductor fabrication 2nm technology nanomanufacturing chip scaling