Using atomic layer etching for 2nm nodes in III-V semiconductor fabrication
semiconductor processing
atomic layer etching
III-V materials
transistor scaling
nanofabrication
Through hybrid bonding for chiplet integration in next-gen computing architectures
chiplet integration
hybrid bonding
3D packaging
semiconductor manufacturing
high-performance computing
Josephson junction frequency standards for lights-out production in semiconductor fabs
Josephson junctions
semiconductor manufacturing
metrology
automation
quantum standards
Directed self-assembly of block copolymers for 2025 cost reduction targets in semiconductor manufacturing
block copolymers
semiconductor
cost reduction
self-assembly
nanotechnology
Employing silicon photonics co-integration for high-speed optical interconnects in data centers
silicon photonics
optical interconnects
data centers
energy efficiency
co-integration
Through quantum dot charge trapping for ultra-high-density data storage solutions
quantum dots
charge trapping
data storage
nanotechnology
high-density memory
Employing silicon photonics co-integration to overcome bandwidth bottlenecks in quantum memory arrays
quantum computing
optical interconnects
CMOS integration
cryogenic photonics
error correction
Using gate-all-around nanosheet transistors for ultra-low-power computing in edge devices
nanosheet transistors
edge computing
low-power design
semiconductor technology
IoT
Employing germanium-silicon strain engineering to enhance hole mobility in advanced CMOS nodes
strain engineering
germanium-silicon
CMOS
hole mobility
semiconductor materials
Through hybrid bonding for chiplet integration at picometer precision
hybrid bonding
chiplet integration
picometer precision
semiconductor packaging
3D ICs
Implementing collaborative robot cells with carbon nanotube vias for 2032 processor manufacturing
carbon nanotube vias
collaborative robots
semiconductor manufacturing
processor nodes
nanoscale assembly
Through EUV mask defect mitigation with machine learning-driven nanoscale repair protocols
EUV lithography
mask defects
machine learning
nanoscale repair
semiconductor fabrication