Advanced semiconductor and nanotechnology development

Uniting glacier physics with semiconductor design for ultra-low-power computing

Glacier physics semiconductor design low-power computing bio-inspired engineering thermal management

Optimizing photomask designs via computational lithography for next-gen semiconductor manufacturing

computational lithography photomask optimization semiconductor manufacturing nanofabrication EUV patterning

Computational lithography optimizations for 2nm semiconductor node patterning

computational lithography semiconductor fabrication EUV patterning machine learning optimization nanoscale manufacturing

Optimizing chiplet integration through hybrid bonding for next-gen processors

hybrid bonding chiplets semiconductor packaging 3D integration heterogeneous computing

Developing silicon photonics co-integration for next-generation optical computing architectures

silicon photonics optical computing co-integration AI hardware bandwidth optimization

Uniting glacier physics with semiconductor design for advanced thermal management solutions

glacier physics semiconductor design thermal management heat dissipation ice dynamics

Directed self-assembly of block copolymers for next-generation 2nm semiconductor nodes

block copolymers self-assembly semiconductor nanolithography 2nm nodes

Via existing manufacturing infrastructure to scale up perovskite solar cells

perovskite solar cells manufacturing scalability renewable energy semiconductor tech photovoltaics

Controlling spin relaxation timescales in quantum dot qubits for error correction

spin relaxation quantum dots qubit stability error mitigation semiconductor qubits

Projecting 2040 applications of lights-out production in fully automated semiconductor fabs

lights-out manufacturing semiconductor fabrication automation Industry 4.0 predictive maintenance

Using atomic layer etching for 2nm node semiconductor fabrication

atomic layer etching semiconductor fabrication 2nm node nanomanufacturing precision engineering

Through hybrid bonding for chiplet integration in next-gen quantum computing architectures

hybrid bonding chiplet integration quantum computing 3D packaging qubit scalability