Description
Product Details of Atomfair High Temperature and High Elongation (HTE) Electrolytic Copper Foil
1. Basic Product Information
1.1 Product Overview
Atomfair High Temperature and High Elongation (HTE) electrolytic copper foil delivers exceptional high-temperature resistance and ductility. It resists oxidation and discoloration in high-heat environments, and its superior ductility enables easy lamination with other materials.
Manufactured via an electrolytic process, the foil features a clean, flat surface with a single-side roughened finish to enhance adhesion with substrates. It boasts high purity and excellent electrical and thermal conductivity. We provide coil-form supply and custom slicing services to meet diverse application needs.
1.2 Product Specifications
| Project | Parameter Range |
|---|---|
| Thickness | 1/4OZ ?20OZ (9? ?70?) |
| Width | 550mm ?1295mm |
1.3 Core Performance (Compliant with IPC-4562-2000 Standard)
| Performance Indicators | Unit | 1/4 oz (9?) | 1/3 oz (12?) | 1 oz (15?) | 1/2 oz (18?) | 1 oz (35?) | 2 oz (70?) |
|---|---|---|---|---|---|---|---|
| Copper Content | % | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 |
| Surface Density | g/m?/td> | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 |
| Tensile Strength (25?, Room Temperature) | Kg/mm?/td> | ≥28 | ≥28 | ≥28 | ≥30 | ≥30 | ≥30 |
| Tensile Strength (180?, High Temperature) | Kg/mm?/td> | ≥15 | ≥15 | ≥15 | ≥15 | ≥15 | ≥15 |
| Elongation (25?, Room Temperature) | % | ≥4.0 | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ≥10 |
| Elongation (180?, High Temperature) | % | ≥4.0 | ≥4.0 | ≥5.0 | ≥6.0 | ≥6.0 | ≥6.0 |
| Gloss Surface Roughness (Ra) | ? | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 |
| Rough Surface Roughness (Rz) | ? | ≤5.0 | ≤5.0 | ≤6.0 | ≤7.0 | ≤9.0 | ≤14 |
| Peel Strength (23?, Room Temperature) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.0 | ≥1.8 | ≥1.3 |
| Degradation Rate (18% RH, 1h, 25?) | % | ≤5.0 | ≤5.0 | ≤5.0 | ≤5.0 | ≤5.0 | ≤5.0 |
| Color Change (190?, 1.0h) | – | Good | Good | Good | Good | Good | Good |
| Tin Bleaching Performance (290?) | Sec | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 |
| Pinhole | EA | None | None | None | None | None | None |
1.4 Product Advantages
- Adopts a special surface treatment process, featuring strong anti-under-cut corrosion performance and reduced residual copper risk.
- Excellent room-temperature storage stability and high-temperature oxidation resistance, meeting IPC-4562 Grade II and III quality requirements.
- High-purity raw materials ensure superior electrical and thermal conductivity.
- Single-side roughened design enhances bonding stability with substrates.
2. Product Applications
Specifically engineered for double-sided and multi-layer printed circuit boards (PCBs) across various resin systems, the foil leverages core advantages of high-temperature resistance, high elongation, and strong adhesion.
It is ideal for PCB manufacturing in precision electronic equipment, communication devices, automotive electronics, and aerospace fields, providing reliable support for circuit transmission stability and product long-term durability.
Note: All performance parameters are tested under standard conditions. For customized specifications or detailed test reports, please contact our technical team.
If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
