Description
Premium silver bonding wire designed for precision applications, available in two high-purity options (88% and 96% Ag). Features a consistent 18μm diameter and comes in convenient 500m spools. Ideal for semiconductor, electronics, and microelectronic bonding processes.
| Material | Purity | Diameter | Length per Spool | Packaging | Pack Size |
|---|---|---|---|---|---|
| Silver Bonding Wire | 88% Ag | 18μm | 500m | Spool | 1 |
| Silver Bonding Wire | 96% Ag | 18μm | 500m | Spool | 1 |
If you are interested or have any questions, please contact us at inquiry@atomfair.com
Disclaimer: Sold exclusively for laboratory research.
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