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Atomfair High Purity Copper Nickel Alloy Sputtering Target (CuNi 50/50 at%, 4N)
High purity (99.95%) copper-nickel alloy sputtering target with a precise 50/50 atomic percentage composition. Ideal for thin film deposition in research and industrial applications. Manufactured using melting process for consistent quality.
Description
High purity (99.95%) copper-nickel alloy sputtering target with a precise 50/50 atomic percentage composition. Ideal for thin film deposition in research and industrial applications. Manufactured using melting process for consistent quality.
| Product Name | Composition | Purity | Dimensions | Form | Packaging |
|---|---|---|---|---|---|
| Copper Nickel Alloy Target | Ni/Cu = 50/50 at% | 99.95% (4N) | ฯ76.2 ร 3mm | Disc | 1 piece per pack |
If you are interested or have any questions, please contact us at inquiry@atomfair.com
Disclaimer: Sold exclusively for laboratory research.
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