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Atomfair High Purity Copper Bonding Wire (Cu) – 18μm & 25μm Diameter
Premium copper bonding wire designed for high-performance electronic applications. Offers excellent conductivity and reliability for semiconductor and microelectronic bonding. Available in precise diameters for various bonding requirements.
Description
Premium copper bonding wire designed for high-performance electronic applications. Offers excellent conductivity and reliability for semiconductor and microelectronic bonding. Available in precise diameters for various bonding requirements.
| Product Type | Diameter | Length per Spool | Packaging | Pack Size |
|---|---|---|---|---|
| Copper Bonding Wire | φ18μm | 1000m | Spool | 1 |
| Copper Bonding Wire | φ25μm | 1000m | Spool | 1 |
If you are interested or have any questions, please contact us at inquiry@atomfair.com
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