Description
This Copper Aluminum (CuAl) alloy sputtering target is manufactured using powder metallurgy, offering high purity (99.5%) and precise composition (90/10 wt%). Ideal for thin film deposition applications, it comes in a standard size of 50x50x2mm with secure packaging.
| Material | Composition (wt%) | Purity | Dimensions (mm) | Manufacturing Process | Packaging | Packaging Size |
|---|---|---|---|---|---|---|
| Copper Aluminum Alloy (CuAl) | Cu/Al = 90/10 | 99.5% | 50 × 50 × 2 | Powder Metallurgy | Piece | 1 |
If you are interested or have any questions, please contact us at inquiry@atomfair.com
Disclaimer: Sold exclusively for laboratory research.
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