Description
Product Details of Atomfair Ultra-Low Profile (VLP) Electrolytic Copper Foil
1. Basic Product Information
1.1 Product Overview
Atomfair Ultra-Low Profile (VLP) Electrolytic Copper Foil is manufactured via an electrolytic process, with core advantages of ultra-low roughness and high peel strength. It features high purity, low impurity content, a smooth and flat surface, and wide width capabilities.
Single-side roughening treatment enhances compatibility with other materials and prevents peeling, making it ideal for diverse precision processing applications.
1.2 Product Specifications
| Project | Parameter Range |
|---|---|
| Nominal Thickness | 1/4oz ?3oz (9um ?105um) |
| Maximum Product Size | 1295mm*1295mm (sheet form) |
| Width Tolerance | 0 ?+2mm |
| Core Specification | Inner Diameter: 79mm (3 inches) |
1.3 Core Performance (Compliant with IPC-4562-2000 Standard)
| Performance Indicator | Unit | 9um | 12um | 18um | 35um | 70um | 105um |
|---|---|---|---|---|---|---|---|
| Copper Content | % | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 |
| Surface Density | g/m?/td> | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 |
| Tensile Strength (23?, Room Temperature) | Kg/mm?/td> | ≥28 | ≥28 | ≥28 | ≥28 | ≥28 | ≥28 |
| Tensile Strength (180?, High Temperature) | Kg/mm?/td> | ≥15 | ≥15 | ≥15 | ≥18 | ≥20 | ≥20 |
| Elongation (23?, Room Temperature) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 | ≥10 | ≥10 |
| Elongation (180?, High Temperature) | % | ≥6.0 | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ≥8.0 |
| Glossy Surface Roughness (Ra) | um | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 |
| Rough Surface Roughness (Rz) | um | ≤3.5 | ≤3.5 | ≤3.5 | ≤3.5 | ≤3.5 | ≤3.5 |
| Peel Strength (23?, Room Temperature) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥0.77 | ≥1.5 | ≥2.0 |
| Degradation Rate (18% RH, 1hr, 25?) | % | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 |
| Color Change (200?, 1.0hr) | – | Good | Good | Good | Good | Good | Good |
| Tin Bleaching Performance (290?) | Sec | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 |
| Appearance (Spots/Copper Powder) | – | None | None | None | None | None | None |
| Pinholes | EA | Zero | Zero | Zero | Zero | Zero | Zero |
1.4 Product Advantages
1.4.1 Advanced Grain Structure
Adopts an equiaxed fine-grained spherical structure, outperforming the columnar grains of comparable overseas products. This structure delivers superior physical properties and higher etching efficiency.
1.4.2 Ultra-Low Profile Advantage
For 3oz (105um) foil, the rough surface Rz is ≤3.5um?urpassing international counterparts with Rz>3.5um. It eliminates the risk of “tooth-like” protrusions penetrating thin insulating layers and causing short circuits during double-sided board pressing.
1.4.3 Excellent Processability
The equiaxed fine-grained structure shortens circuit etching time and reduces uneven side etching. High peel strength prevents delamination after lamination and avoids copper powder transfer, enabling the production of PCBs with sharp, clear patterns.
1.4.4 Reliable Fundamental Performance
High purity and low impurities ensure stable electrical and thermal conductivity. Wide width and flat surface meet the demands of large-scale, high-precision manufacturing.
2. Product Applications
Leveraging ultra-low profile, high peel strength, and excellent processability, the product is widely used in high-end sectors including automotive, power, communications, defense, and aerospace.
As a core material for manufacturing high-power PCBs and high-frequency boards, it provides key support for circuit stability, signal transmission efficiency, and durability of high-end electronic devices.
Note: All performance parameters are tested under standard conditions (23?, 1 atm). For customized specifications, sample testing, or detailed IPC compliance reports, please contact our technical team.
If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
