Atomfair Heat-Resistant STD Electrolytic Copper Foil, for Medical Equipment Shielding

Atomfair STD Electrolytic Copper Foil (9±40um), IPC-4562 Grades II&III, offers top shielding, easy etching & high temp/corrosion resistance. 1290mm max width, ideal for PCBs, auto, aerospace & electronics shielding.

Description

Product Details of Atomfair Standard Electrolytic Copper Foil (STD)

1. Basic Product Information

1.1 Product Overview

Atomfair Standard Electrolytic Copper Foil (STD, Type E per IPC-4562) is crafted from high-purity copper, delivering exceptional electrical conductivity, easy etching, and superior electromagnetic interference (EMI) & microwave shielding capabilities. Manufactured via an advanced electrolytic process, it offers a maximum width of 1290mm and a flat profile for seamless bonding with various materials.
Boasting high-temperature oxidation resistance and corrosion resistance, it excels in harsh environments with strict lifespan requirements. Its quality fully complies with IPC-4562 Grade II and Grade III standards, meeting rigorous printed circuit board (PCB) industry demands.

1.2 Product Specifications

Project
Parameter Range
Nominal Thickness
9um, 12um (1/3oz), 18um, 35um, 50um, 70um (2oz), 105um, 140um (4oz)
Maximum Width
1290mm
Width Tolerance
0 – +2mm
Core Specification
Inner Diameter: 76mm (3 inches)

1.3 Core Performance (Compliant with IPC-4562-2000 Standard)

Performance Indicator
Unit
9um
12um
18um
35um
50um
70um
105um
140um
Copper Content
%
≥99.8
≥99.8
≥99.8
≥99.8
≥99.8
≥99.8
≥99.8
≥99.8
Surface Density
g/m²
80±3
107±3
153±5
283±7
440±8
585±10
875±15
1160±20
Tensile Strength (23℃, Room Temperature)
Kg/mm²
≥28
≥28
≥28
≥28
≥28
≥28
≥28
≥28
Tensile Strength (180℃, High Temperature)
Kg/mm²
≥15
≥15
≥15
≥18
≥18
≥20
≥20
≥20
Elongation (23℃, Room Temperature)
%
≥5.0
≥5.0
≥6.0
≥10
≥10
≥10
≥10
≥10
Elongation (180℃, High Temperature)
%
≥6.0
≥6.0
≥8.0
≥8.0
≥8.0
≥6.0
≥8.0
≥8.0
Glossy Surface Roughness (Ra)
um
≤0.43
≤0.43
≤0.43
≤0.43
≤0.43
≤0.43
≤0.43
≤0.43
Matte Surface Roughness (Rz)
um
≤3.5
≤3.5
≤3.5
≤3.5
≤3.5
≤3.5
≤3.5
≤3.5
Peel Strength (23℃, Room Temperature)
Kg/cm
≥0.77
≥0.8
≥0.9
≥1.0
≥0.77
≥1.5
≥2.0
≥2.2
Degradation Rate (18% RH, 1hr, 25℃)
%
≤7.0
≤7.0
≤7.0
≤7.0
≤7.0
≤7.0
≤7.0
≤7.0
Discoloration Resistance (200℃, 1.0hr)
Good
Good
Good
Good
Good
Good
Good
Good
Tin Bleaching Performance (290℃)
Sec
≥20
≥20
≥20
≥20
≥20
≥20
≥20
≥20
Appearance (Spots/Copper Powder)
None
None
None
None
None
None
None
None
Pinholes
EA
Zero
Zero
Zero
Zero
Zero
Zero
Zero
Zero

1.4 Product Advantages

1.4.1 Superior Electromagnetic Shielding

High-purity copper composition ensures exceptional electrical conductivity, providing reliable shielding against EMI, microwave interference, and static interference—critical for precision electronic applications requiring signal integrity.

1.4.2 Excellent Processability

Features an equiaxed fine-grained spherical structure, which shortens circuit etching time and minimizes uneven side etching. A specialized surface roughening process creates a shallow, rounded profile (vs. jagged traditional surfaces) to prevent electrical breakdown and ensure processing consistency.

1.4.3 Outstanding Adhesion & Durability

Flat sheet profile enables seamless bonding with substrates. High peel strength guarantees long-term adhesion stability, while zero copper powder transfer supports the production of PCB products with sharp, clear circuit patterns. High-temperature oxidation and corrosion resistance ensure performance in harsh operating environments.

1.4.4 Broad Adaptability

Offers a maximum width of 1290mm and a comprehensive thickness range (9um-140um) with customization options. Additional properties including moisture resistance, chemical corrosion resistance, thermal conductivity, and UV resistance make it suitable for diverse industrial needs.

2. Product Applications

Leveraging multi-dimensional performance advantages, STD copper foil serves key high-end markets:
Circuit Manufacturing: Critical material for high-power PCBs and high-frequency boards in automotive, power electronics, telecommunications, military, and aerospace industries—where reliability and performance under stress are paramount.
Electromagnetic Shielding: Meets shielding requirements for transformers, cables, mobile devices, computers, and medical equipment. Provides core protection for signal stability and extended equipment service life in sensitive electronic systems.
Note: All performance parameters are tested under standard conditions (23℃, 1 atm). As an IPC-compliant supplier, we provide detailed certification documents. For customized specifications or sample testing, please contact our technical team.
If you’re interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.