Description
Product Details of Atomfair Inverted Treatment Electrolytic Copper Foil (RTF)
1. Basic Product Information
1.1 Product Overview
Atomfair Inverted Treatment Electrolytic Copper Foil (RTF) is a double-sided product with differential roughness treatments. It significantly enhances peel strength on both sides, making it ideal as an intermediate layer for bonding with other materials.
The double-sided differentiated design allows the side with a thinner rough layer to be more easily etched. The roller-treated surface features higher roughness, ensuring stronger adhesion to dielectric materials. Its matte surface enables direct photoresist bonding without pretreatment, delivering excellent bonding resistance.
1.2 Product Specifications
| Project | Parameter Range |
|---|---|
| Nominal Thickness | 12um (1/3OZ), 18um (1/2OZ), 35um (1OZ) |
| Maximum Width | 1295mm |
| Compatible Substrate | FR-4 |
1.3 Core Performance
| Performance Indicator | Unit | 12um (1/3OZ) | 18um (1/2OZ) | 35um (1OZ) |
|---|---|---|---|---|
| Copper Content | % | ≥99.8 | ≥99.8 | ≥99.8 |
| Surface Density | g/m?/td> | 107±3 | 153±5 | 283±5 |
| Tensile Strength (25?, Room Temperature) | Kg/mm?/td> | ≥28.0 | ≥28.0 | ≥28.0 |
| Tensile Strength (180?, High Temperature) | Kg/mm?/td> | ≥15.0 | ≥15.0 | ≥18.0 |
| Elongation (25?, Room Temperature) | % | ≥5.0 | ≥6.0 | ≥8.0 |
| Elongation (180?, High Temperature) | % | ≥6.0 | ≥6.0 | ≥6.0 |
| Glossy Surface Roughness (Ra) | um | ≤0.6 | ≤0.7 | ≤0.8 |
| Matte Surface Roughness (Rz) | um | ≤4.0 | ≤5.0 | ≤6.0 |
| Peel Strength (23?, Room Temperature) | Kg/cm | ≥1.1 | ≥1.2 | ≥1.5 |
| Degradation Rate (18% RH, 1hr, 25?) | % | ≤5.0 | ≤5.0 | ≤5.0 |
| Discoloration Resistance (190?, 1.0hr) | – | No Discoloration | No Discoloration | No Discoloration |
| Tin Bleaching Performance (290?) | Sec | ≥20 | ≥20 | ≥20 |
| Pinholes | EA | None | None | None |
1.4 Product Advantages
1.4.1 Superior Double-Sided Adhesion
Electroplating technology precisely controls the size and distribution of copper nodules. Double-sided differential roughening ensures high peel strength, with the roller-treated surface offering exceptional adhesion to dielectric materials.
1.4.2 High Processing Efficiency
The matte surface enables direct photoresist bonding without mechanical or chemical pretreatment, shortening the production cycle. The thinner rough layer side allows easier etching, improving processing precision.
1.4.3 Reliable Usage Safety
Smooth surface inverted treatment reduces post-lamination copper foil roughness. Combined with excellent etching performance, it minimizes short-circuit risks and ensures consistent product quality.
1.4.4 Broad Adaptability
Supports direct multi-layer lamination and maintains stable performance at high temperatures, making it suitable for diverse precision processing scenarios.
2. Product Applications
With high adhesion, excellent etching performance, and stable high-temperature characteristics, RTF is widely used in manufacturing high-frequency products and inner laminated boards. It is particularly compatible with equipment requiring strict signal transmission and structural stability, such as 5G base stations and automotive radars.
Additionally, it is ideal for inner-layer production of various high-precision printed circuit boards (PCBs), providing critical support for equipment high-frequency performance and durability.
Note: All performance parameters are tested under standard conditions (25?, 1 atm). For customized specifications, compatibility tests with non-FR-4 substrates, or technical samples, please contact our team.
If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
