Description
1. Product Overview
Atomfair Ultra-Thick Low-Profile Electrolytic Copper Foil combines customizable thickness, ultra-low roughness, and high peel strength as its core advantages. Its matte surface resists powder shedding, and we offer custom slicing services to meet diverse application needs across industries.
2. Product Specifications
We supply Ultra-Thick Low-Profile High-Temperature Ductile Electrolytic Copper Foil (VLP-HTE-HF) with comprehensive specifications to support large-scale and customized production demands:
| Specification Item | Parameter Range |
|---|---|
| Nominal Thickness (Weight) | 3oz (105um) ?12oz (420um) |
| Maximum Product Size | 1295mm * 1295mm (Sheet Foil) |
| Core Specification | Inner Diameter: 79mm (3 inches) |
3. Core Performance
Our ultra-thick electrolytic copper foil exhibits exceptional physical properties, characterized by equiaxed fine grains, low profile, high strength, and high elongation. Detailed performance parameters are as follows:
| Performance Indicator | Unit | 3oz (105um) | 4oz (140um) | 6oz (210um) | 8oz (280um) | 10oz (315um) | 12oz (420um) |
|---|---|---|---|---|---|---|---|
| Copper Content | % | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 |
| Surface Density (Area Weight) | g/m?/td> | 915±45 | 1120±60 | 1830±90 | 2240±120 | 3050±150 | 3660±180 |
| Tensile Strength (23?, Room Temperature) | Kg/mm?/td> | ≥28 | ≥28 | ≥28 | ≥28 | ≥28 | ≥28 |
| Tensile Strength (180?, High Temperature) | Kg/mm?/td> | ≥15 | ≥15 | ≥15 | ≥15 | ≥15 | ≥15 |
| Elongation (23?, Room Temperature) | % | ≥10 | ≥10 | ≥20 | ≥20 | ≥20 | ≥20 |
| Elongation (180?, High Temperature) | % | ≥5.0 | ≥5.0 | ≥5.0 | ≥5.0 | ≥5.0 | ≥5.0 |
| Glossy Surface Roughness (Ra) | um | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 |
| Matte Surface Roughness (Rz) | um | ≤3.5 | ≤5.0 | ≤7.5 | ≤10.1 | ≤10.1 | ≤10.1 |
| Peel Strength (23?, Room Temperature) | Kg/cm | ≥1.1 | ≥1.3 | ≥1.5 | ≥1.8 | ≥2.0 | ≥2.2 |
| Discoloration Resistance (200?, 1.0hr) | – | Good | Good | Good | Good | Good | Good |
| Pinholes | EA | Zero | Zero | Zero | Zero | Zero | Zero |
4. Product Advantages (vs. Foreign Counterparts)
4.1 Superior Grain Structure
Atomfair VLP brand features an equiaxed fine spherical grain structure, whereas foreign equivalents typically have columnar and elongated grains. This structure significantly enhances mechanical properties and processing stability, reducing defects during manufacturing.
4.2 Ultra-Low Profile
Our product boasts an ultra-low profile?oz foil has a matte surface Rz ≤ 3.5um. In contrast, foreign standard-profile products have a 3oz matte surface Rz > 3.5um. This advantage optimizes subsequent processing quality, especially for fine-circuit applications.
5. Core Value Propositions
5.1 Eliminates Short-Circuit Risks
The ultra-low profile fundamentally avoids the “wolf-tooth” effect of standard thick copper foil?here excessive roughness penetrates thin PP insulating sheets during double-sided lamination?educing short-circuit risks and boosting product yield.
5.2 Optimizes Etching Process
Equiaxed fine spherical grains shorten circuit etching time, significantly reduce uneven side etching, and improve both circuit processing precision and production efficiency?ritical for high-volume manufacturing.
5.3 Enhances PCB Manufacturing Quality
High peel strength combined with zero copper powder transfer enables the production of PCBs with sharp, clear circuit patterns, meeting the strict precision and reliability requirements of high-end electronic manufacturing.
6. Product Applications
With outstanding performance and quality, Atomfair Ultra-Thick Low-Profile Electrolytic Copper Foil is widely used in high-end industries including automotive, power electronics, telecommunications, military, and aerospace. It serves as a core material for manufacturing high-power PCBs and high-frequency boards, providing a solid foundation for the stable operation of high-end electronic equipment.
Note: All performance parameters are tested under standard conditions (23?, 1 atm). We offer customized thicknesses, sizes, and surface treatments. For technical samples or compatibility tests with specific substrates, please contact our team.
If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
