For biodegradable electronics using transient polymers and edible conductive materials
biodegradable electronics
transient polymers
edible conductors
e-waste reduction
sustainable tech
In quantum radar systems for stealth aircraft detection at terahertz frequencies
quantum radar
stealth detection
terahertz imaging
entanglement-enhanced sensing
defense technology
For solid-state battery breakthroughs through sulfide-based electrolyte optimization
solid-state batteries
sulfide electrolytes
energy storage
battery safety
material science
Optimizing viral vector engineering for long-term gene therapy stability with 15-year ROI horizons
viral vectors
gene therapy
biostability
ROI optimization
genetic engineering
Employing self-healing materials in aerospace components to reduce maintenance costs over geological epochs
self-healing materials
aerospace engineering
maintenance reduction
durability
extreme environments
At Josephson junction frequencies with patent-expired innovations for scalable quantum computing
quantum coherence
superconducting circuits
intellectual property
microwave engineering
cryogenic systems
Sustainable hydrogen storage via microwave-assisted synthesis of metal-organic frameworks
hydrogen storage
metal-organic frameworks
microwave synthesis
sustainable energy
porous materials
Using atomic layer etching for 2nm nodes in semiconductor fabrication
atomic layer etching
semiconductor manufacturing
2nm technology
nanofabrication
Moore's Law
Through accidental discovery pathways in high-entropy alloy research
high-entropy alloys
serendipitous discovery
materials science
metallurgy
advanced manufacturing
At exciton diffusion lengths in perovskite solar cell optimization
exciton diffusion
perovskite solar cells
renewable energy
photovoltaics
charge transport
Through femtosecond laser ablation: creating ultra-precise microfluidic channels for lab-on-a-chip devices
femtosecond laser
microfluidics
lab-on-a-chip
precision manufacturing
medical diagnostics
Exploring hybrid bonding techniques for scalable chiplet integration in next-gen computing
hybrid bonding
chiplet integration
3D packaging
semiconductor manufacturing
interconnect technology