Sustainable materials and green technologies

Through back-end-of-line thermal management in 3D integrated circuits

3D ICs thermal management semiconductor packaging heat dissipation advanced materials

Enhancing computational efficiency in quantum circuits via gate-all-around nanosheet transistors

quantum circuits nanosheet transistors power efficiency computational design semiconductor technology

In attojoule energy regimes for ultra-low-power quantum computing

attojoule energy quantum computing low-power electronics quantum bits nanoscale physics

Through hybrid bonding for chiplet integration in next-generation semiconductor devices

hybrid bonding chiplet integration semiconductors 3D packaging interconnect technology

For femtosecond pulse interactions with exotic quantum materials under extreme conditions

femtosecond pulses quantum materials extreme conditions ultrafast spectroscopy light-matter interactions

With patent-expired innovations in perovskite solar cell manufacturing

perovskite solar cells patent-expired tech scalable manufacturing photovoltaics renewable energy

Optimizing quantum error correction via backside power delivery networks in superconducting qubits

quantum computing error correction power delivery superconducting qubits noise reduction

Via redox flow battery optimization for long-duration grid-scale energy storage

redox flow batteries grid storage renewable integration energy density cost reduction

Atomic layer etching precision for 2nm node quantum dot qubit fabrication

atomic layer etching 2nm nodes quantum dots qubit fabrication defect minimization

Enhancing chiplet integration through hybrid bonding for next-gen processors

hybrid bonding chiplets semiconductor 3D integration processor architecture

Synthesizing biodegradable metal-organic frameworks for targeted drug delivery in tumors

nanomedicine MOF synthesis controlled release tumor microenvironment biodegradable materials

Through hybrid bonding for chiplet integration in high-performance quantum computing platforms

hybrid bonding chiplet integration quantum computing semiconductor packaging interconnects