Quantum and advanced computing innovations

For exascale system integration through back-end-of-line thermal management in 3D chip stacks

exascale computing thermal management 3D integration advanced packaging heat dissipation

Preparing for 2032 processor nodes with 3D-stacked photonic interconnects

photonic interconnects processor nodes 3D integration semiconductor technology high-performance computing

Optimizing exascale system integration through rapid prototyping cycles for high-performance computing

exascale computing rapid prototyping high-performance computing system integration scalability

Through hybrid bonding for chiplet integration in next-gen computing architectures

chiplet integration hybrid bonding 3D packaging semiconductor manufacturing high-performance computing

Optimizing sparse mixture-of-experts models for real-time edge computing applications

sparse models mixture-of-experts edge computing neural networks efficiency optimization

Through hybrid bonding for chiplet integration in next-gen computing

hybrid bonding chiplet integration semiconductor high-performance computing advanced packaging

Optimizing exascale system integration for real-time climate modeling under El Niño oscillations

exascale computing climate modeling El Niño supercomputing atmospheric science

Optimizing sparse mixture-of-experts models for efficient large language model training

mixture-of-experts sparse models LLM efficiency distributed training neural scaling

For exascale system integration: Few-shot hypernetworks managing heterogeneous computing architectures

exascale computing hypernetworks few-shot learning HPC optimization heterogeneous systems

Enhancing sparse mixture-of-experts models for efficient large-scale language model training

mixture-of-experts sparse models language models AI efficiency neural networks

Through hybrid bonding for chiplet integration at petapascal pressure regimes in extreme computing

chiplet integration hybrid bonding high-pressure computing advanced packaging extreme environments

Backside power delivery networks for 22nd century energy-efficient computing architectures

backside power delivery energy-efficient computing 3D ICs power networks semiconductor design