Developing ruthenium-based interconnects for next-generation semiconductor devices
ruthenium interconnects
semiconductor scaling
thermal conductivity
chip design
Moore’s Law
Scalable nanofabrication via directed self-assembly of block copolymers for next-gen electronics
nanofabrication
block copolymers
directed self-assembly
semiconductor
nanotechnology
Using gate-all-around nanosheet transistors for sub-3nm semiconductor scaling
nanosheet transistors
semiconductor scaling
advanced CMOS
nanoelectronics
transistor architecture
Preparing for 2032 processor nodes with novel semiconductor materials and architectures
semiconductor materials
processor nodes
Moore's Law
advanced architectures
2032 technology
Optimizing back-end-of-line thermal management through nanoscale phase-change materials
thermal management
phase-change materials
nanoscale
integrated circuits
heat dissipation
Enhancing semiconductor performance via self-assembled monolayer doping for nanoscale devices
semiconductor doping
nanoscale fabrication
monolayer assembly
surface chemistry
electronic devices
3D monolithic integration of photonic chips for ultra-low-power optical computing
photonic computing
3D integration
optical neural networks
silicon photonics
energy-efficient AI
Through EUV mask defect mitigation in sub-3nm semiconductor fabrication
semiconductor manufacturing
EUV lithography
mask defects
nanofabrication
chip scaling
Uniting glacier physics with semiconductor design for cryogenic computing
glacier physics
cryogenic computing
semiconductor design
heat dissipation
interdisciplinary engineering
Back-end-of-line thermal management solutions for 3nm semiconductor nodes and beyond
thermal management
semiconductor
3nm node
heat dissipation
BEOL
Mitigating EUV mask defects for next-generation semiconductor lithography at picometer precision
EUV lithography
mask defects
semiconductor manufacturing
picometer precision
nanofabrication
Preparing for 2032 processor nodes with 3D-stacked photonic interconnects
photonic interconnects
processor nodes
3D integration
semiconductor technology
high-performance computing