Description

Key Properties & Advantages
This LSC641 cathode current collector slurry combines high-performance electrochemistry with durable processability, tailored for SOFC interconnect environments:

High Solids Content (60–75%): Enables thick or thin film deposition in minimal coats, forming a dense, conductive layer after sintering—critical for low-resistance current collection and long-term stability in oxidizing atmospheres.
Fine Fineness (<5 μm): Ensures uniform dispersion of LSC641 particles, preventing agglomerates that could block oxygen diffusion or disrupt electron flow. The sub-5 μm size promotes intimate contact with cathode active layers (e.g., LSC641 or LSCF) and interconnect surfaces, enhancing conductivity. Dual-Viscosity Options for Versatile Coating: 3000–4500 cP: Optimized for screen printing or doctor blading, ideal for thick (10–30 μm) collector layers on flat interconnects, ensuring no sagging and uniform coverage. 600–1500 cP: Perfect for spray coating or dip coating, enabling smooth, thin (5–15 μm) films on complex interconnect geometries, maintaining porosity for oxygen diffusion while ensuring conductivity. Enhanced Anti-Oxidation Performance: LSC641’s cobalt-rich composition forms a protective oxide layer in oxidizing environments (air), resisting degradation at 600–800°C—critical for long-term stability in SOFC interconnects exposed to high-temperature air. Exceptional MIEC Conductivity: LSC641’s intrinsic ability to conduct both electrons and oxygen ions enhances oxygen reduction reaction (ORR) activity at the cathode-interconnect interface, reducing polarization resistance and boosting SOFC power density. Broad Compatibility: Compatible with common SOFC cathode materials (LSC641, LSCF), electrolytes (GDC, YSZ), and metallic interconnects (ferritic stainless steels), ensuring minimal interfacial reactions and thermal expansion matching. Strong Adhesion: Formulated with a high-temperature binder system that burns out cleanly during sintering (400–600°C), leaving a porous yet robust LSC641 layer that withstands thermal cycling without delamination or cracking. Core Applications SOFC Interconnect Layers & Cathode Current Collection This LSC641 slurry is a critical component in SOFC cathode design, optimizing current collection and oxidation protection in interconnect layers: Cathode Current Collector Layers: Applied as a conductive bridge between the cathode active layer and metallic interconnects, it reduces contact resistance and ensures efficient electron transport from the ORR site to the interconnect. Interconnect Protection: Forms a protective coating on metallic interconnects, preventing chromium evaporation (a common cathode poison in SOFCs) and resisting oxidation in high-temperature air, extending interconnect lifespan. Thick-Film & Thin-Film Coating: The 3000–4500 cP formulation suits thick-film applications (e.g., planar SOFC interconnects), providing robust conductivity and mechanical stability. The 600–1500 cP option enables thin-film coating on textured or curved interconnects, maintaining oxygen diffusion pathways while ensuring uniform current distribution. High-Temperature Electrochemical Devices Oxygen Separation Membranes: Used as a conductive current collector in oxygen separation systems, leveraging its high-temperature stability and oxygen ion conductivity. Technical Specifications Its active component is high-purity LSC641 (La₀.₆Sr₀.₄CoO₃₋δ), with a solids content of 60–75 wt.% (including LSC641 and binder system). The fineness (maximum particle size, laser diffraction method) is <5 μm, and the viscosity options are 3000–4500 cP or 600–1500 cP (measured at 25°C using the Brookfield method). The binder system is a high-temperature organic binder (burns out cleanly at 400–600°C), the color is a black to dark gray slurry, and the sintering temperature is 950–1100°C in air (2-hour ramp + 1-hour hold). Solids content measurement to confirm 60–75 wt.% range. Fineness analysis (laser diffraction) to verify <5 μm particle size. Viscosity testing (Brookfield method) to ensure compliance with 3000–4500 cP or 600–1500 cP specifications. Adhesion testing (tape test post-sintering) to confirm layer integrity. Conductivity testing at 600–800°C to validate electrochemical performance. .