Description

Tungsten Hexafluoride (WF₆) is a highly reactive inorganic compound composed of tungsten and six fluorine atoms. This colorless to pale yellow gas is widely utilized in semiconductor and electronics manufacturing due to its excellent chemical vapor deposition (CVD) properties. With a CAS number of 7783-82-6 and molecular formula F₆W, it is a critical precursor for depositing tungsten thin films in integrated circuits and microelectromechanical systems (MEMS). Tungsten hexafluoride is stored under high-pressure cylinders and requires careful handling due to its corrosive and toxic nature. Its high purity grade (>99.9%) ensures optimal performance in advanced material synthesis and nanofabrication processes.

Properties

• CAS Number: 7783-82-6
• Complexity: 62.7
• IUPAC Name: hexafluorotungsten
• InChI: InChI=1S/6FH.W/h6*1H;/q;;;;;;+6/p-6
• InChI Key: NXHILIPIEUBEPD-UHFFFAOYSA-H
• Exact Mass: 297.941352
• Molecular Formula: F6W
• Molecular Weight: 297.83
• SMILES: F[W](F)(F)(F)(F)F
• Monoisotopic Mass: 297.941352
• Physical Description: Tungsten hexafluoride appears as a toxic corrosive light yellow liquid or gas. Noncombustible. Used in the manufacture of other chemicals and in the manufacture of electronics.
• Color/Form: Yellow liquid or colorless gas
• Boiling Point: 67 °F
• Melting Point: 37 °F
• Solubility: Reacts with water
• Density: 3.44 g/cu cm
• Heat of Vaporization: 26.5 kJ/mol at 17.1 °C
• Synonyms: Tungsten hexafluoride, Hexafluorotungsten, 7783-82-6, Tungsten fluoride, Tungsten fluoride (WF6), (OC-6-11)-, UNII-45B0AG2C4S, HSDB 8038, Tungsten fluoride (WF6), EINECS 232-029-1, UN2196, 45B0AG2C4S, EC 232-029-1, DTXSID80893770, UN 2196, DTXCID001323805, TUNGSTEN HEXAFLUORIDE (WF6), 232-029-1, nxhilipieubepd-uhfffaoysa-h, tungsten hexafluoride [mi], tungsten(6+) fluoride, un-2196, wolfram hexafluoride, Tungsten(VI) fluoride, Tungsten hexafluoride [UN2196] [Poison gas], Hexafluorotungsten #, MFCD00040536, hexakis(fluoranyl)tungsten, Tungsten hexafluoride 99%, SCHEMBL49839, Tungsten(VI) fluoride, >=99.9%, A839236, Q418962, Tungsten(VI) fluoride, packaged for use in deposition systems, >=99.9%

Application

Tungsten hexafluoride is primarily used in the semiconductor industry for tungsten metallization via chemical vapor deposition (CVD). It enables the production of low-resistance interconnects and contacts in integrated circuits. Additionally, WF₆ is employed in the fabrication of diffusion barriers and gate electrodes in advanced microelectronics. Its reactivity with hydrogen or silane makes it ideal for precise thin-film deposition processes. Research applications include catalysis and materials science studies.

Safety and Hazards

GHS Hazard Statements

• H280: Contains gas under pressure; may explode if heated [Warning Gases under pressure]
• H330: Fatal if inhaled [Danger Acute toxicity, inhalation]

Precautionary Statements

• P260, P271, P284, P304+P340, P316, P320, P403+P233, P405, P410+P403, and P501

Hazard Classes and Categories

• Press. Gas (100%)
• Acute Tox. 3 (26.8%)
• Acute Tox. 3 (26.8%)
• Skin Corr. 1A (100%)
• Eye Dam. 1 (13.4%)
• Acute Tox. 2 (72.5%)

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