Description

Tin(II) bis(methanesulfonate) (CAS No. 53408-94-9) is a high-purity organotin compound with the molecular formula C₂H₆O₆S₂Sn, widely used in electroplating, catalysis, and chemical synthesis. This white to off-white crystalline solid exhibits excellent solubility in polar solvents, making it ideal for applications requiring precise tin deposition. Its methanesulfonate (mesylate) ligands enhance stability and reactivity, ensuring consistent performance in industrial and research settings. Suitable for advanced material science, electronics, and surface treatment processes, this compound is rigorously tested for purity and batch-to-batch consistency. Packaged under inert conditions to prevent oxidation, it is a reliable choice for demanding laboratory and production environments.

Properties

• CAS Number: 53408-94-9
• Complexity: 79.2
• IUPAC Name: stannous;methanesulfonate
• InChI: InChI=1S/2CH4O3S.Sn/c2*1-5(2,3)4;/h2*1H3,(H,2,3,4);/q;;+2/p-2
• InChI Key: JALQQBGHJJURDQ-UHFFFAOYSA-L
• Exact Mass: 309.862783
• Molecular Formula: C2H6O6S2Sn
• Molecular Weight: 308.9
• SMILES: CS(=O)(=O)[O-].CS(=O)(=O)[O-].[Sn+2]
• Topological: 131
• Monoisotopic Mass: 309.862783
• Physical Description: 50% Aqueous solution: Colorless liquid;
• Synonyms: Stannous methanesulfonate, Methanesulfonic acid, tin(2+) salt, Tin(II) methanesulfonate, tin(II) bis(methanesulfonate), DTXSID1068851, Methanesulfonic acid, tin(2+) salt (2:1), EC 401-640-7, DTXCID0041430, 401-640-7, 53408-94-9, Methanesulfonicacidtin(2+)salt, Stannous methylsulfonate, methanesulfonate;tin(2+), SCHEMBL755360, QYQ355J39M, JALQQBGHJJURDQ-UHFFFAOYSA-L, MFCD00137737, AKOS015912666, DB-071678, Tin(II) methanesulfonate, 50% w/w aq. soln., A829570, Methanesulfonic acid tin(2+) salt; Tin(II) methanesulfonate

Application

Tin(II) bis(methanesulfonate) is primarily used as an efficient tin source in electroplating baths for producing uniform, corrosion-resistant coatings on conductive surfaces. It serves as a catalyst or precursor in organic synthesis, particularly for Stille coupling reactions and polymerizations. In electronics manufacturing, it enables the deposition of tin layers on circuit boards and components, enhancing solderability and conductivity.

Safety and Hazards

GHS Hazard Statements

• H302 (99.6%): Harmful if swallowed [Warning Acute toxicity, oral]
• H314 (100%): Causes severe skin burns and eye damage [Danger Skin corrosion/irritation]
• H317 (100%): May cause an allergic skin reaction [Warning Sensitization, Skin]
• H318 (68.9%): Causes serious eye damage [Danger Serious eye damage/eye irritation]
• H411 (99.1%): Toxic to aquatic life with long lasting effects [Hazardous to the aquatic environment, long-term hazard]

Precautionary Statements

• P260, P261, P264, P264+P265, P270, P272, P273, P280, P301+P317, P301+P330+P331, P302+P352, P302+P361+P354, P304+P340, P305+P354+P338, P316, P317, P321, P330, P333+P317, P362+P364, P363, P391, P405, and P501

Hazard Classes and Categories

• Acute Tox. 4 (99.6%)
• Skin Corr. 1B (100%)
• Skin Sens. 1 (100%)
• Eye Dam. 1 (68.9%)
• Aquatic Chronic 2 (99.1%)

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