Atomfair Porous Copper Foam for Battery and Supercapacitor Research (100mm×100mm×0.15mm/100mm×100mm×0.2mm/300mm×200mm×1.0mm/200mm×300mm×1.5mm/200mm×300mm1.6mm)

This product is manufactured via advanced foaming technology, featuring a three-dimensional interconnected network structure. Its porosity ranges from 90% to 98%, with pore sizes flexibly selectable between 100μm and 2000μm. It also boasts a high specific surface area, excellent electrical and thermal conductivity, as well as good mechanical toughness. As a core porous metal material, it has been widely applied in industries such as energy, chemical engineering, and electronics.

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Description

Core Product Parameters

Item Specification Parameters
Name Copper Foam
Pore Size 10PPI-130PPI, 5μm-45μm
Thickness 0.1mm-35mm
Purity ≥99.9%
Porosity 75%-98%
Open Cell Rate ≥97%
Area Density 280g/m²-4800g/m²
Maximum Dimension 500mm×1000mm×H (Customizable)
Standard Dimensions 100mm×100mm×0.15mm/100mm×100mm×0.2mm/300mm×200mm×1.0mm/200mm×300mm×1.5mm/200mm×300mm1.6mm
Cutting Method Wire Cutting, Laser Cutting, Special-Shaped Part Processing

Key Performance Features

  1. Excellent thermal conductivity enables efficient heat transfer, suitable for various heat dissipation scenarios.
  2. Superior electrical conductivity provides reliable conductive support for electrode-related applications.
  3. Possesses a unique three-dimensional interconnected network structure and is basically harmless to the human body.
  4. Good mechanical toughness allows adaptation to usage requirements under different working conditions.
  5. Outstanding electromagnetic shielding performance, comparable to that of silver.

Applicable Application Fields

  1. Electrode Materials: Can be used as the electrode skeleton material for new-type batteries such as nickel-zinc batteries and supercapacitors, which have been trialed and mass-produced by many relevant manufacturers. It is also suitable as an electrode material for electrolytic recovery of copper-containing wastewater, with broad application prospects.
  2. Catalyst Carrier: Leveraging its high specific surface area advantage, it can replace punched copper plates as a catalyst for various organic chemical reactions. It has achieved successful application as a carrier in the field of photocatalytic air purification.
  3. Thermal Conductive and Heat Dissipating Materials: Due to its good thermal conductivity, it serves as a high-performance flame-retardant material, widely used in advanced fire-fighting equipment, especially exhibiting excellent effectiveness in flame isolation. Additionally, it can be made into heat-dissipating materials for motors and electrical appliances, balancing thermal conductivity and apparent permeability.
  4. Sound-Absorbing and Electromagnetic Shielding Materials: Sound waves undergo diffuse reflection on its surface, achieving sound absorption through principles such as expansion silencing and micropore silencing. Its excellent electromagnetic shielding performance can meet various electromagnetic shielding requirements.
  5. Filter Materials: Relying on its superior structural characteristics and being basically harmless to the human body, it has been successfully applied in the medical filtration field. It also holds good application prospects in water purification devices.
  6. Fluid Pressure Buffering Materials: It has a good dispersion and buffering effect on fluids, making it an excellent pressure reduction and protection device for various pressure gauges with outstanding usage effects.

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