Description

Methoxyethyl cyanoacrylate (CAS: 27816-23-5) is a high-purity, fast-curing cyanoacrylate adhesive monomer with the molecular formula C₇H₉NO₃ and IUPAC name 2-methoxyethyl 2-cyanoprop-2-enoate. This specialized acrylate ester features a reactive cyano group and methoxyethyl ester moiety, enabling rapid anionic polymerization upon exposure to surface moisture. Exhibiting low viscosity (typically 2-5 cP at 25°C) and moderate volatility, it demonstrates superior wetting properties for non-porous substrates. The methoxyethyl side chain enhances flexibility in cured films compared to standard ethyl cyanoacrylates while maintaining >20 MPa tensile strength. Supplied as a clear, colorless liquid with <99% purity (GC), it is stabilized with 100-200 ppm hydroquinone to prevent premature polymerization. Compatible with most metals, plastics, and elastomers, this product is particularly valued for medical device assembly and electronic component bonding applications where controlled cure speed and minimal blooming are critical. Store under inert atmosphere at 2-8°C to maintain optimal shelf stability.

Properties

• CAS Number: 27816-23-5
• Complexity: 201
• IUPAC Name: 2-methoxyethyl 2-cyanoprop-2-enoate
• InChI: InChI=1S/C7H9NO3/c1-6(5-8)7(9)11-4-3-10-2/h1,3-4H2,2H3
• InChI Key: JYTXVMYBYRTJTI-UHFFFAOYSA-N
• Exact Mass: 155.058243149
• Molecular Formula: C7H9NO3
• Molecular Weight: 155.15
• SMILES: COCCOC(=O)C(=C)C#N
• Topological: 59.3
• Monoisotopic Mass: 155.058243149
• Synonyms: 2-Methoxyethyl 2-cyanoacrylate, 27816-23-5, 2-Propenoic acid, 2-cyano-, 2-methoxyethyl ester, METHOXYETHYL CYANOACRYLATE, E6N1APF30P, EINECS 248-670-5, MXBON MECA MONOMER, DTXSID0067341, EC 248-670-5, DTXCID0037734, METHOXYETHYL CYANOACRYLATE [INCI], 248-670-5, 2-methoxyethyl 2-cyanoprop-2-enoate, UNII-E6N1APF30P, 2-Methoxyethyl2-cyanoacrylate, SCHEMBL487323, JYTXVMYBYRTJTI-UHFFFAOYSA-N, MFCD28361936, DB-251563, NS00009615, E83794

Application

Methoxyethyl cyanoacrylate is widely employed as a rapid-cure adhesive in medical device manufacturing, particularly for assembling catheter components and disposable surgical instruments due to its biocompatibility and flexible bond line. In electronics, it serves as a dielectric adhesive for surface-mount component attachment where its low ionic content prevents circuit degradation. The compound’s unique balance of cure speed and bond flexibility makes it suitable for bonding dissimilar materials like polycarbonate to stainless steel in analytical instrument fabrication.

Safety and Hazards

GHS Hazard Statements

• Not Classified
• Reported as not meeting GHS hazard criteria by 165 of 166 companies (only 0.6% companies provided GHS information). For more detailed information, please visit ECHA C&L website.

Hazard Classes and Categories

• Not Classified

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