Description

Tetrakis(dimethylamino)titanium(IV) (CAS No. 3275-24-9) is a highly specialized organometallic compound with the molecular formula C₈H₂₄N₄Ti. This titanium-based coordination complex features four dimethylamino ligands bound to a central titanium(4+) ion, making it a valuable precursor in advanced materials synthesis and thin-film deposition processes. Its high purity and thermal stability render it ideal for applications in chemical vapor deposition (CVD) and atomic layer deposition (ALD) of titanium-containing films. The compound is supplied as a moisture-sensitive liquid or solid, requiring handling under inert atmosphere conditions to prevent degradation. Researchers and material scientists utilize this reagent for its precise stoichiometric control in the fabrication of semiconductors, optical coatings, and ceramic materials. Available in various packaging options to suit laboratory and industrial-scale requirements.

Properties

• CAS Number: 3275-24-9
• Complexity: 24.1
• IUPAC Name: dimethylazanide;titanium(4+)
• InChI: InChI=1S/4C2H6N.Ti/c4*1-3-2;/h4*1-2H3;/q4*-1;+4
• InChI Key: MNWRORMXBIWXCI-UHFFFAOYSA-N
• Exact Mass: 224.1480375
• Molecular Formula: C8H24N4Ti
• Molecular Weight: 224.17
• SMILES: C[N-]C.C[N-]C.C[N-]C.C[N-]C.[Ti+4]
• Topological: 4
• Monoisotopic Mass: 224.1480375
• Synonyms: 3275-24-9, EINECS 221-904-3, Methanamine, N-methyl-, titanium(4+) salt (4:1), Tetrakis(dimethylamino)titanium(IV), Tetrakis(dimethylamino)titanium, TDMAT, Tetrakis(dimethylamido)titanium(IV), Methanamine, N-methyl-, titanium(4+) salt, MFCD00014861, Ti(NMe2)4, SCHEMBL45685, NSC130237, AKOS015850795, NSC-130237, titanium(4+) tetrakis(dimethylazanide), D92585, Tetrakis(dimethylamido)titanium(IV), technical grade, >=80%, Tetrakis(dimethylamido)titanium(IV), 99.999% trace metals basis, Tetrakis(dimethylamido)titanium(IV), packaged for use in deposition systems, Tetrakis(dimethylamino)titanium(IV), 99% TDMAT (99.99%-Ti) PURATREM, 1449521-72-5

Application

Tetrakis(dimethylamino)titanium(IV) serves as a crucial precursor in the deposition of titanium nitride (TiN) and titanium oxide (TiO₂) thin films through CVD and ALD techniques. These films find applications in semiconductor device fabrication, wear-resistant coatings, and photocatalytic systems. The compound’s volatility and clean decomposition profile make it particularly suitable for high-purity film growth in microelectronics. Additionally, it finds use in catalysis research for organic transformations involving titanium-mediated bond formations.

Safety and Hazards

GHS Hazard Statements

• H225 (100%): Highly Flammable liquid and vapor [Danger Flammable liquids]
• H260 (91.7%): In contact with water releases flammable gases which may ignite spontaneously [Danger Substances and mixtures which in contact with water, emit flammable gases]
• H302+H332 (14.3%): Harmful if swallowed or if inhaled [Warning Acute toxicity, oral; acute toxicity, inhalation]
• H302 (42.9%): Harmful if swallowed [Warning Acute toxicity, oral]
• H314 (100%): Causes severe skin burns and eye damage [Danger Skin corrosion/irritation]
• H318 (16.7%): Causes serious eye damage [Danger Serious eye damage/eye irritation]
• H331 (26.2%): Toxic if inhaled [Danger Acute toxicity, inhalation]
• H332 (16.7%): Harmful if inhaled [Warning Acute toxicity, inhalation]

Precautionary Statements

• P210, P223, P231+P232, P233, P240, P241, P242, P243, P260, P261, P264, P264+P265, P270, P271, P280, P301+P317, P301+P330+P331, P302+P335+P334, P302+P361+P354, P303+P361+P353, P304+P340, P305+P354+P338, P316, P317, P321, P330, P363, P370+P378, P402+P404, P403+P233, P403+P235, P405, and P501

Hazard Classes and Categories

• Flam. Liq. 2 (100%)
• Water-react. 1 (91.7%)
• Acute Tox. 4 (42.9%)
• Skin Corr. 1B (100%)
• Eye Dam. 1 (16.7%)
• Acute Tox. 3 (26.2%)
• Acute Tox. 4 (16.7%)

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