Description
Product Details of Atomfair Tin-Plated Copper Foil
1. Basic Product Information
Atomfair Tin-Plated Copper Foil is a high-performance functional material manufactured by applying a professional tin-plating process to high-purity rolled copper foil substrates. Leveraging tin’s metallic properties, it forms a tin dioxide oxidation protective film, effectively preventing copper substrate oxidation. It also boasts excellent electrical conductivity and stability, and supports customized processing.
Specific specification parameters are detailed in the table below:
| Specification Items | Solderable Tin-Plated Copper Foil | Non-Solderable Tin-Plated Copper Foil |
|---|---|---|
| Product Name | Atomfair Solderable Tin-Plated Copper Foil | Atomfair Non-Solderable Tin-Plated Copper Foil |
| Base Material | High-precision rolled copper foil (JIS C1100 & ASTM C11000), copper content ≥ 99.96% | High-precision rolled copper foil (JIS C1100 & ASTM C11000), copper content ≥ 99.96% |
| Substrate Thickness Range | 0.035?.15 mm (0.0013?.0059 inches) | 0.012?.15 mm (0.00047?.0059 inches) |
| Substrate Width Range | ≤ 300 mm (≤ 11.8 inches) | ≤ 600 mm (≤ 23.62 inches) |
| Substrate Customization | Available as per customer requirements | Available as per customer requirements |
| Tin Layer Thickness | ≥ 0.3 um | ≥ 0.2 um |
| Tin Layer Composition | 65%?2% tin (adjustable to match customer soldering processes) | 100% pure tin |
| Tin Layer Surface Resistance | 0.3?.5 O | 0.1?.15 O |
| Adhesion Grade | 5B (compliant with ASTM D3359 standard) | 5B (compliant with ASTM D3359 standard) |
| Mechanical Performance Retention | Tensile strength degradation ≤ 10% after plating; Elongation degradation ≤ 6% after plating | Tensile strength degradation ≤ 10% after plating; Elongation degradation ≤ 6% after plating |
1.1 Core Features
- Superior Anti-Oxidation: The tin layer forms a dense tin dioxide protective film, effectively isolating the copper substrate from oxidation.
- Excellent Conductivity & Surface Quality: Maintains the copper substrate’s inherent high electrical conductivity with a smooth surface for stable downstream processing.
- Strong Layer Adhesion: The tin-copper bonding is firm, with no risk of tin layer peeling during processing or use.
- Stable Mechanical Properties: Minimal degradation of tensile strength and elongation after plating, ensuring consistent performance.
- Flexible Customization: Supports adjustments to substrate state, tin layer content, thickness, and other parameters based on customer needs.
2. Product Applications
With anti-oxidation as its core advantage and multi-dimensional excellent performance, this product is widely applicable to electronics, civilian, and other high-end fields. Core applications are as follows:
2.1 Electronic & Electrical Industry
Ideal for precision printed circuit boards (PCBs), electronic components, connectors, and plugs. Its anti-oxidation property ensures stable conductivity during long-term use, avoiding resistance increase and transmission loss caused by oxide layers. The solderable type meets welding process requirements, while the non-solderable type caters to high-purity conductive scenarios with pure tin properties (compliant with IPC-4562 standard).
2.2 Civilian Field
2.2.1 Food Contact Scenarios
Applied in beverage packaging, food contact tools (e.g., metal tableware, food packaging liners). The tin layer is safe, non-toxic, and highly stable (compliant with FDA 21 CFR ?75.300 food contact standards), preventing copper substrate from contaminating food. Its good ductility and processability adapt to various packaging and tool forming requirements.
2.2.2 Daily Hardware Products
Suitable for civilian hardware accessories, wire and cable joints. Anti-oxidation and anti-corrosion properties extend product service life, preventing rust and deterioration from long-term exposure to air.
2.3 Other Fields
Also used in low-loss conductive components for automotive electronics and medical devices. Stable conductive performance and protective features meet processing and application requirements of different scenarios, ensuring product reliability (medical-grade variants comply with ISO 10993 biocompatibility standards).
Note: All performance parameters are tested under standard conditions (25?, 1 atm). For customized specifications, food contact certification, or detailed test reports, please contact our technical team.
If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
