Atomfair Disodium 3,3′-dipropanedisulfonate disulfide SPS C6H12Na2O6S4 CAS 27206-35-5

Disodium 3,3′-dipropanedisulfonate disulfide (CAS No. 27206-35-5) is a high-purity organosulfur compound with the molecular formula C6H12Na2O6S4. This white to off-white crystalline powder is widely recognized for its role as an electrolyte additive, particularly in electroplating and semiconductor applications. With excellent water solubility and stability, it serves as a critical brightening agent and leveler in copper electrodeposition processes, ensuring uniform and defect-free metal coatings. Our product meets stringent quality standards, offering >98% purity (HPLC) with low trace metal content, making it ideal for research, industrial, and electronic-grade applications. Packaged under inert conditions to prevent oxidation, each batch includes comprehensive analytical documentation…

Description

Disodium 3,3′-dipropanedisulfonate disulfide (CAS No. 27206-35-5) is a high-purity organosulfur compound with the molecular formula C6H12Na2O6S4. This white to off-white crystalline powder is widely recognized for its role as an electrolyte additive, particularly in electroplating and semiconductor applications. With excellent water solubility and stability, it serves as a critical brightening agent and leveler in copper electrodeposition processes, ensuring uniform and defect-free metal coatings. Our product meets stringent quality standards, offering >98% purity (HPLC) with low trace metal content, making it ideal for research, industrial, and electronic-grade applications. Packaged under inert conditions to prevent oxidation, each batch includes comprehensive analytical documentation (COA, MSDS).

Key Features:

  • Synonyms: Bis(sodium sulfopropyl) disulfide (SPS), 3,3′-Dithiobis(1-propanesulfonic acid) disodium salt
  • Molecular Weight: 354.36 g/mol
  • Solubility: >100 mg/mL in water (25°C)
  • Applications: Electroplating additive, semiconductor fabrication, biochemical research
  • Storage: Room temperature, desiccated

Properties

  • CAS Number: 27206-35-5
  • Complexity: 296
  • IUPAC Name: disodium;3-(3-sulfonatopropyldisulfanyl)propane-1-sulfonate
  • InChI: InChI=1S/C6H14O6S4.2Na/c7-15(8,9)5-1-3-13-14-4-2-6-16(10,11)12;;/h1-6H2,(H,7,8,9)(H,10,11,12);;/q;2*+1/p-2
  • InChI Key: WIYCQLLGDNXIBA-UHFFFAOYSA-L
  • Exact Mass: 353.93121136
  • Molecular Formula: C6H12Na2O6S4
  • Molecular Weight: 354.4
  • SMILES: C(CSSCCCS(=O)(=O)[O-])CS(=O)(=O)[O-].[Na+].[Na+]
  • Topological: 182
  • Monoisotopic Mass: 353.93121136
  • Synonyms: 1-Propanesulfonic acid, 3,3′-dithiobis-, disodium salt, Di(thiopropane sodium sulfonate), Disodium 3,3′-dipropanedisulfonate disulfide, B802Q7NMRI, EINECS 248-324-3, 1-Propanesulfonic acid, 3,3′-dithiobis-, sodium salt (1:2), gamma,gamma’-Sulfopropyldisulfide, disodium salt, DTXSID00889695, 3,3′-Dithiobis(1-propanesulfonic acid), disodium salt, BIS(SODIUM SULFOPROPYL) DISULFIDE, Disodium 3,3′-dithiobis(propanesulphonate), Disodium 3,3′-dithiobis[propanesulphonate], 1-Propanesulfonic acid, 3,3′-dithiodi-, disodium salt, DTXCID701028947, 27206-35-5, Bis-(sodium sulfopropyl)-disulfide, 3,3′-Dithiobis-1-Propanesulfonic Acid Disodium Salt, disodium;3-(3-sulfonatopropyldisulfanyl)propane-1-sulfonate, Sodium 3,3′-disulfanediylbis(propane-1-sulfonate), disodium 3-[(3-sulfonatopropyl)disulfanyl]propane-1-sulfonate, Disodium 3,3′-Dithiobis(1-propanesulfonate), UNII-B802Q7NMRI, SCHEMBL421602, bis(sodium sulfopropyl)disulfide, Bis-(sodiumsulfopropyl)-disulfide, WIYCQLLGDNXIBA-UHFFFAOYSA-L, MFCD01104840, AKOS015913016, FD10908, Bis-(sodium sulfopropyl)-disulfide(SPS), AS-18647, D5159, NS00084161, ST50999156, D90370, A818954, 3,3′-Dithiobis(1-propanesulfonic Acid) Disodium Salt, Q27274479, 3-[(3-sulfopropyl)disulfanyl]propanesulfonic acid, sodium salt, sodium salt, SPS((3/4)U paragraph signthornAo paragraph signthorn+/-uIe>>CEaAAE)

Disodium 3,3′-dipropanedisulfonate disulfide (SPS) is primarily employed as an accelerator in acid copper electroplating baths, where it enhances deposition uniformity and reduces surface roughness. In semiconductor manufacturing, it facilitates void-free copper filling of high-aspect-ratio trenches and vias during damascene processes. Researchers also utilize its disulfide bridge as a reversible crosslinker in polymer chemistry or as a thiol-reactive probe in protein studies. Its sulfonate groups provide aqueous solubility while maintaining electrochemical stability under plating conditions.

Safety and Hazards

GHS Hazard Statements

  • H317 (100%): May cause an allergic skin reaction [Warning Sensitization, Skin]

Precautionary Statements

  • P261, P272, P280, P302+P352, P321, P333+P317, P362+P364, and P501

Hazard Classes and Categories

  • Skin Sens. 1 (100%)

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Disclaimer

Intended Use & Restrictions

This product is sold exclusively for laboratory research, analytical testing, or non-commercial purposes.

  • Strictly prohibited: Resale, repackaging, or formulation into commercial products.
  • Not approved for human/animal use, diagnostics, or manufacturing (including pharmaceuticals, agrochemicals, or consumer goods).

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