Description
Product Details of Atomfair Treated RA Copper Foil (Single-Sided Roughened High-Precision Copper Foil)
1. Basic Product Information
Atomfair Treated RA Copper Foil is a high-precision functional material designed to enhance peel strength. It undergoes single-sided roughening treatment and high-temperature anti-oxidation technology, with production and packaging carried out in a dust-free workshop (Class 1000-10000, compliant with ISO 14644-1). The product features stable performance, high cleanliness, and supports customized production.
Specific specification parameters are listed below:
| Specification Items | Specific Parameters |
|---|---|
| Core Processes | 1. Single-sided roughening treatment (enhances peel strength); 2. Bright surface high-temperature anti-oxidation treatment (prevents discoloration during high-temperature processing) |
| Treatment Types | 1. Reddening treatment (main component: copper powder, red surface); 2. Blackening treatment (main components: cobalt-nickel powder, black surface) |
| Thickness Range | 12-70um (1/3-2 oz) (compliant with IPC-4562 standard) |
| Width Range | 150-600mm (5.9-23.6 inches) |
| Production Environment | Dust-free workshop production and packaging, high cleanliness |
| Customization Service | Available, tailored to customer requirements |
1.1 Core Features
- Stable thickness tolerance (±3% of nominal thickness) and uniform copper buds on the roughened surface with no powder shedding
- Superior mechanical properties: high flexibility, excellent ductility, smooth and flat surface, strong fatigue resistance, and outstanding oxidation resistance
- High bending resistance: no cracking during repeated bending tests (passes 10,000+ bending cycles at 180?
- High cleanliness: meets the cleanliness requirements of electronic grade materials (particle count ≤ 5 particles/100cm?for particles ≥ 5um)
2. Product Applications
With the core advantage of single-sided roughening and multi-dimensional excellent performance, this product is ideally suited for high-end electronic material processing scenarios. Core applications are as follows:
2.1 Flexible Copper Clad Laminate (FCCL) Manufacturing
As a core base material, its roughened matte surface enhances composite adhesion with other materials, effectively preventing peeling and detachment. Combined with high flexibility and bending resistance, it meets the bending and folding requirements of flexible boards, ensuring long-term structural stability of the boards (compliant with IPC-4101 specifications).
2.2 Fine-Circuit FPC (Flexible Printed Circuit Board) Production
It meets the strict requirements of fine-circuit processing for material precision and surface consistency. Stable thickness tolerance and uniform copper buds ensure circuit printing accuracy (supports minimum line width/spacing of 30um/30um). High ductility and fatigue resistance adapt to repeated bending scenarios of FPC in electronic devices, avoiding circuit breakage or substrate damage.
2.3 LED Flip-Chip Film Preparation
With high cleanliness (from dust-free workshop production) and excellent composite performance, it serves as the core conductive substrate for LED flip-chip films. Anti-oxidation treatment prevents conductive performance degradation caused by oxidation during processing and use, ensuring stable light emission and long service life of LED devices (conforms to JEDEC J-STD-001 soldering standards).
Note: For detailed test reports (including peel strength, oxidation resistance, and cleanliness test data) or customized specification inquiries, please contact our technical support team.
If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
