Description

Copper(II) hexafluoroacetylacetonate (CAS No. 14781-45-4) is a high-purity, anhydrous copper coordination compound with the molecular formula C₁₀H₄CuF₁₂O₄. This advanced organometallic reagent is widely utilized in materials science, catalysis, and thin-film deposition processes. The compound features two hexafluoroacetylacetonate (hfac) ligands chelated to a central copper(II) ion, offering exceptional thermal stability and volatility, making it ideal for chemical vapor deposition (CVD) and atomic layer deposition (ALD) applications. With a purity of 99.99+% (electrical grade), this product is optimized for semiconductor manufacturing, nanotechnology research, and high-performance coatings. Its unique fluorine-rich structure ensures excellent reactivity and compatibility with advanced electronic and optoelectronic materials. Packaged under inert gas to maintain stability, this reagent is a critical tool for researchers and engineers working in cutting-edge material synthesis.

Properties

• CAS Number: 14781-45-4
• Complexity: 527
• IUPAC Name: copper;(Z)-1,1,1,5,5,5-hexafluoro-4-hydroxy-pent-3-en-2-one
• InChI: InChI=1S/2C5H2F6O2.Cu/c2*6-4(7,8)2(12)1-3(13)5(9,10)11;/h2*1,12H;/b2*2-1-;
• InChI Key: HFCSRRSYLKFYFX-PAMPIZDHSA-N
• Exact Mass: 478.921394
• Molecular Formula: C10H4CuF12O4
• Molecular Weight: 479.66
• SMILES: C(=C(O)/C(F)(F)F)C(=O)C(F)(F)F.C(=C(O)/C(F)(F)F)C(=O)C(F)(F)F.[Cu]
• Topological: 74.6
• Monoisotopic Mass: 478.921394
• Synonyms: 14781-45-4, copper(ii)hexafluor-2,4-pentanedionate, Copper(II) hexafluoroacetylacetonate, COPPER(II) HEXAFLUORO-2,4-PENTANEDIONATE, Copper hexafluoroacetylacetonate hydrate, BIS(HEXAFLUOROACETYLACETONATO)COPPER(II) HYDRATE, MFCD00064754, AKOS007930372, AS-64470, F14025, Copper(II) hexafluoroacetylacetonate, anhydrous, elec. gr. (99.99+%-Cu) PURATREM, (3Z)-1,1,1,5,5,5-HEXAFLUORO-4-[({[(2Z)-1,1,1,5,5,5-HEXAFLUORO-4-OXOPENT-2-EN-2-YL]OXY}CUPRIO)OXY]PENT-3-EN-2-ONE

Copper(II) hexafluoroacetylacetonate is primarily used as a precursor for copper thin-film deposition in semiconductor and microelectronics fabrication. Its high volatility and thermal stability make it suitable for CVD and ALD processes to create conductive coatings and interconnects. The compound is also employed in catalysis for organic transformations and as a dopant in advanced material synthesis. Researchers leverage its properties for developing nanostructured copper oxides and metal-organic frameworks (MOFs). Additionally, it serves as a key reagent in the production of superconducting and photonic materials.

Safety and Hazards

GHS Hazard Statements

• H302 (33.3%): Harmful if swallowed [Warning Acute toxicity, oral]
• H315 (66.7%): Causes skin irritation [Warning Skin corrosion/irritation]
• H319 (66.7%): Causes serious eye irritation [Warning Serious eye damage/eye irritation]
• H332 (33.3%): Harmful if inhaled [Warning Acute toxicity, inhalation]
• H335 (33.3%): May cause respiratory irritation [Warning Specific target organ toxicity, single exposure; Respiratory tract irritation]

Precautionary Statements

• P261, P264, P264+P265, P270, P271, P280, P301+P317, P302+P352, P304+P340, P305+P351+P338, P317, P319, P321, P330, P332+P317, P337+P317, P362+P364, P403+P233, P405, and P501

Hazard Classes and Categories

• Acute Tox. 4 (33.3%)
• Skin Irrit. 2 (66.7%)
• Eye Irrit. 2 (66.7%)
• Acute Tox. 4 (33.3%)

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