Description
Atomfair Diamond Composite Heat Sink
Structural Layers & Thickness Range
| Structural Layer | Thickness Range |
|---|---|
| Diamond Layer | 0.3–1 mm |
| Copper Plating Layer | 50–200 μm |
| Nickel Plating Layer | 0.5–5 μm |
| Gold Plating Layer | 0.5–2 μm |
Comprehensive Performance Indicators
| Performance Indicator | Parameter Range |
|---|---|
| Comprehensive Thermal Conductivity | 600–800 W/m·K |
| Coefficient of Thermal Expansion (25–200℃) | 4–6×10⁻⁷ K⁻¹ |
Product Advantages
Based on high thermal conductivity diamond substrate, combined with copper/nickel/gold composite plating layers, it balances ultra-high thermal conductivity and low coefficient of thermal expansion. Suitable for precision thermal management needs of high-power semiconductors, laser devices and other scientific research scenarios, with excellent structural stability.
If you’re interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
