Description

2,2′-((3,3′,5,5′-Tetramethyl-(1,1′-biphenyl)-4,4′-diyl)-bis(oxymethylene))-bis-oxirane (CAS No. 85954-11-6) is a high-purity biphenyl-based epoxy compound with the molecular formula C₂₂H₂₆O₄. This specialized chemical features a symmetrical structure with two epoxy-functionalized oxymethylene bridges attached to a tetramethylbiphenyl core, offering excellent thermal stability and reactivity for advanced polymer synthesis. Ideal for researchers developing high-performance epoxy resins, adhesives, or composite materials requiring controlled cross-linking density. Supplied as a crystalline solid with >95% purity (HPLC), this compound is rigorously tested by GC-MS and ¹H NMR to ensure batch-to-batch consistency. Store under inert atmosphere at 2-8°C to maintain stability of the epoxy groups.

Properties

• CAS Number: 85954-11-6
• Complexity: 403
• IUPAC Name: 2-[[4-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]-2,6-dimethyl-phenoxy]methyl]oxirane
• InChI: InChI=1S/C22H26O4/c1-13-5-17(6-14(2)21(13)25-11-19-9-23-19)18-7-15(3)22(16(4)8-18)26-12-20-10-24-20/h5-8,19-20H,9-12H2,1-4H3
• InChI Key: HRSLYNJTMYIRHM-UHFFFAOYSA-N
• Exact Mass: 354.18310931
• Molecular Formula: C22H26O4
• Molecular Weight: 354.4
• SMILES: CC1=CC(=CC(=C1OCC2CO2)C)C3=CC(=C(C(=C3)C)OCC4CO4)C
• Topological: 43.5
• Monoisotopic Mass: 354.18310931
• Synonyms: 4,4′-Bis(2,3-epoxypropoxy)-3,3′,5,5′-tetramethylbiphenyl, DTXSID60888669, 2,2′-((3,3′,5,5′-tetramethyl-(1,1′-biphenyl)-4,4′-diyl)-bis(oxymethylene))-bis-oxirane, Oxirane, 2,2′-((3,3′,5,5′-tetramethyl(1,1′-biphenyl)-4,4′-diyl)bis(oxymethylene))bis-, Oxirane, 2,2′-[(3,3′,5,5′-tetramethyl[1,1′-biphenyl]-4,4′-diyl)bis(oxymethylene)]bis-, DTXCID901027945, 413-900-7, 638-770-0, 85954-11-6, Tetramethylbiphenyl diglycidyl ether, 2-[[4-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]-2,6-dimethylphenoxy]methyl]oxirane, EC 413-900-7, 4,4/’-Bis(2,3-epoxypropoxy)-3,3/’,5,5/’-tetramethylbiphenyl, 2-[({3,3′,5,5′-tetramethyl-4′-[(oxiran-2-yl)methoxy]-[1,1′-biphenyl]-4-yl}oxy)methyl]oxirane, HRSLYNJTMYIRHM-UHFFFAOYSA-N, 4,4′-Dihydroxy-3,3′,5,5′-tetramethylbiphenyl diglycidyl Ether; Tetramethylbiphenyl Diglycidyl Ether; YX 4000HK Monomer; 4,4′-Bis(2,3-epoxypropoxy)-3,3′,5,5′-tetramethylbiphenyl; 2-[[4-[3,5-Dimethyl-4-(oxiran-2-ylmethoxy)phenyl]-2,6-dimethylphenoxy]methyl]oxirane, SCHEMBL49658, 89118-70-7, AKOS015916382, AS-70279, CS-0456487, NS00077649, D95977, 4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl, 4,4′-Bis(2,3-epoxypropoxy)-3,3′,5,5′-tetramethylbiphenyl, 4,4a(2)-Bis(2,3-epoxypropoxy)-3,3a(2),5,5a(2)-tetramethylbiphenyl, 2,2′-(((3,3′,5,5′-Tetramethyl-[1,1′-biphenyl]-4,4′-diyl)bis(oxy))bis(methylene))bis(oxirane)

Application

This tetramethylbiphenyl diepoxide serves as a critical monomer for synthesizing high-T_g epoxy resins used in aerospace composites and electronic encapsulants. The sterically hindered structure enhances thermal resistance in cured networks while maintaining processability. Researchers utilize it to develop low-dielectric materials for 5G applications and as a crosslinker for specialty adhesives requiring dimensional stability under thermal cycling.

Safety and Hazards

GHS Hazard Statements

• Not Classified

Precautionary Statements

• P261, P272, P280, P302+P352, P317, P321, P333+P317, P362+P364, and P501

Hazard Classes and Categories

• Skin Sens. 1 (100%)
• Carc. 2 (100%)

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