Atomfair 2-inch GaN-on-SiC HEMT Epitaxial Wafer Silicon Carbide (SiC) 2 inch Lattice Mismatch 3.50% Thermal Expansion Difference 25% 5×10 8/cm2

Silicon has long been a key semiconductor for most electronic applications, yet it is less efficient than silicon carbide (SiC) wafers. Now adopted in diverse uses-especially electric vehicles-SiC wafers address energy and cost challenges in developing high-efficiency, high-power devices. Composed of pure silicon and carbon, they outperform silicon in three key aspects: higher critical avalanche breakdown field, greater thermal conductivity, and wider bandgap (3eV). They withstand 8x higher voltage gradients than silicon, have lower high-temperature leakage current, higher current density, thinner structures (1/10 the thickness of silicon epitaxial layers), and lower conduction loss (2x higher doping concentration than silicon).

Description

Specifications
Substrate Material Silicon Carbide (SiC)
Diameter 2 inch
Lattice Mismatch 3.50%
Thermal Expansion Difference 25%
Defect Density 5×108/cm2
Leakage Current High
Integration Potential Medium

Combines SiC’s excellent thermal conductivity with GaN’s high-frequency and low-loss characteristics. Ideal for RF applications including 5G base stations and defense sector power amplifiers.