Description
| Characteristics | |
|---|---|
| Substrate Material | Sapphire |
| Diameter | 2 inch |
| Uniformity | Excellent |
| Breakdown Voltage | High |
| Buffer Leakage | Very Low |
| Electron Concentration | High |
| Electron Mobility | High |
| Sheet Resistance | Low |
Thermal management achieved through flip-chip bonding to thermally conductive substrates like AlN ceramics.

