Description

1,3-Bis(4-aminophenoxy)propane (CAS No. 52980-20-8) is a high-purity aromatic diamine compound with the molecular formula C₁₅H₁₈N₂O₂, widely used in polymer and materials science research. This compound, also known by its IUPAC name 4-[3-(4-aminophenoxy)propoxy]aniline, features two reactive amino groups separated by a flexible propyl ether linkage, making it an excellent monomer for synthesizing polyimides, epoxy resins, and other high-performance polymers. Its unique structure contributes to enhanced thermal stability, mechanical strength, and solubility in organic solvents, making it ideal for advanced material applications. Packaged under strict quality control, our product is supplied as a crystalline solid with ≥98% purity, ensuring consistent performance in your experiments. Suitable for use in academic, industrial, and pharmaceutical research, this chemical is handled with care to maintain its integrity and reactivity.

Properties

• CAS Number: 52980-20-8
• Complexity: 210
• IUPAC Name: 4-[3-(4-aminophenoxy)propoxy]aniline
• InChI: InChI=1S/C15H18N2O2/c16-12-2-6-14(7-3-12)18-10-1-11-19-15-8-4-13(17)5-9-15/h2-9H,1,10-11,16-17H2
• InChI Key: KWFFEQXPFFDJER-UHFFFAOYSA-N
• Exact Mass: 258.136827821
• Molecular Formula: C15H18N2O2
• Molecular Weight: 258.32
• SMILES: C1=CC(=CC=C1N)OCCCOC2=CC=C(C=C2)N
• Topological: 70.5
• Monoisotopic Mass: 258.136827821
• Synonyms: 1,3-Bis(4-aminophenoxy)propane, 1,3-bis[4-aminophenoxy]propane, 4-[3-(4-aminophenoxy)propoxy]aniline, 52980-20-8, 4,4′-(1,3-propanediyl)dioxydianiline, 4,4′-(Propane-1,3-diylbis(oxy))dianiline, C15H18N2O2, 4-[3-(4-Aminophenoxy)propoxy]phenylamine, MFCD00025331, Benzenamine, 4,4′-[1,3-propanediylbis(oxy)]bis-, SCHEMBL561615, DTXSID30341392, SBB051752, AKOS024319276, AS-62927, 4-[3-(4-Aminophenoxy)propoxy]phenylamine #, CS-0453293, ST50410342, A12603, Benzenamine, 4-[3-(4-aminophenoxy)propoxy]-, 4,4′-[1,3-Propanediyl]bis[oxy]-bis-benzeneamine

Application

1,3-Bis(4-aminophenoxy)propane is primarily used as a monomer in the synthesis of polyimides and epoxy resins, offering excellent thermal and mechanical properties for high-performance materials. Its flexible ether linkage improves processability and solubility, making it valuable for coatings, adhesives, and composite matrices. Researchers also utilize it in the development of optoelectronic materials and as a crosslinking agent in polymer networks. This compound is particularly favored in aerospace and microelectronics industries for its stability under extreme conditions.

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