Description
Product Details of Atomfair Flexible Electrolytic Copper Foil (FCF)
1. Basic Product Information
1.1 Product Overview
Atomfair Flexible Electrolytic Copper Foil (FCF) is specifically engineered for the flexible printed circuit board (FPC) and flexible copper-clad laminate (FCCL) industries. Manufactured via an electrolytic process, it is oil-free and outperforms standard copper foil in ductility, peel strength, and surface smoothness/fineness.
With excellent fold resistance and strong high-temperature compatibility with TPI materials, this high-density product is available in black or red surface colors, perfectly suited for flexible material precision processing.
1.2 Product Specifications
| Project | Parameter Range |
|---|---|
| Thickness | 9um ?35um |
| Width Tolerance | 0 ?+2mm |
| Core Specification | Inner Diameter: 79mm (3 inches) |
| Surface Color | Black, Red |
1.3 Core Performance (Compliant with IPC-4562-2000 Standard)
| Performance Indicator | Unit | 9um | 12um | 18um | 35um |
|---|---|---|---|---|---|
| Copper Content | % | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 |
| Surface Density | g/m?/td> | 80±3 | 107±3 | 153±5 | 283±7 |
| Tensile Strength (23?, Room Temperature) | Kg/mm?/td> | ≥28 | ≥28 | ≥28 | ≥28 |
| Tensile Strength (180?, High Temperature) | Kg/mm?/td> | ≥15 | ≥15 | ≥15 | ≥18 |
| Elongation (23?, Room Temperature) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥5.0 |
| Elongation (180?, High Temperature) | % | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 |
| Glossy Surface Roughness (Ra) | um | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 |
| Matte Surface Roughness (Rz) | um | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 |
| Peel Strength (23?, Room Temperature) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Degradation Rate (18% RH, 1hr, 25?) | % | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 |
| Discoloration Resistance (200?, 1.0hr) | – | Good | Good | Good | Good |
| Tin Bleaching Performance (290?) | Sec | ≥20 | ≥20 | ≥20 | ≥20 |
| Appearance (Spots/Copper Powder) | – | None | None | None | None |
| Pinholes | EA | Zero | Zero | Zero | Zero |
1.4 Product Advantages
1.4.1 Exceptional Flexibility
High ductility and superior fold resistance enable reliable performance in repeated bending scenarios (e.g., FPC applications) without breakage or damage, meeting the core demands of flexible electronics.
1.4.2 Superior Composite Performance
Oil-free electrolytic manufacturing eliminates grease residues, ensuring tight bonding with flexible substrates like TPI under high-temperature conditions and enhancing overall product stability.
1.4.3 Excellent Processability
Low surface roughness, high finish, and outstanding etching performance collectively meet the high-precision processing requirements of fine-circuit FPC, supporting intricate circuit design.
1.4.4 Stable & Reliable Quality
High copper content guarantees excellent electrical conductivity. Zero pinholes, no appearance defects, and high-temperature discoloration resistance ensure compliance with industry high standards.
2. Product Applications
As a core material for the FPC industry, FCF is widely used in three key areas:
- FCCL Manufacturing: Provides conductive and structural support for flexible laminates, the foundational component of FPC.
- Fine-Circuit FPC Production: Creates precision flexible circuits for consumer electronics (mobile phones, laptops, etc.).
- Optoelectronics: Ensures stable optoelectronic signal transmission in applications like LED flip-chip films, leveraging its balanced flexibility and conductivity.
It also extends to high-end fields requiring flexible circuits, including wearable devices and automotive electronics.
Note: All performance parameters are tested under standard conditions (23?, 1 atm). For customized thicknesses, color options, or compatibility tests with specific substrates, please contact our technical team.
If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
