Description

Product Details of Atomfair Rolled Copper Foil

1. Basic Product Information

Atomfair Rolled Copper Foil is a premium functional material crafted from high-purity C11000 copper (copper content > 99.90%) via a precision rolling process. It exhibits exceptional electrical/thermal conductivity, flexibility, and processability, with customizable thickness, width, and hardness. The product complies with multiple international standards.

Specific specification parameters are listed below:

Specification Items	Specific Parameters
Product Name	Atomfair Rolled Copper Foil
Base Material	C11000 copper (equivalent to ASTM Cu-ETP, JIS C1100, DIN EN 1652 Cu-ETP), copper content > 99.90%
Thickness Range	0.01?.15 mm (0.0004?.006 inches)
Thickness Tolerance	0.01?.015 mm: ±0.002 mm; 0.018?.10 mm: ±0.003 mm; 0.10?.15 mm: ±0.005 mm
Width Range	4?00 mm (0.16?6 inches)
Width Tolerance	4?50 mm: ±0.1 mm; 250?00 mm: Complies with corresponding international standards
Hardness States	Soft (O), Semi-hard (1/2H), Hard (H); Hardness adjustable via annealing process
Physical Properties	Density: 8.9 g/cm? Conductivity (20?): Annealed ≥90% IACS, Rolled ≥80% IACS; Thermal conductivity (20?): 390 W/(m?); Elastic modulus: 118,000 N/m; Softening temperature: ≥380?
Mechanical Properties	Soft (O): Tensile strength 220?75 N/mm? Elongation ≥15%, Hardness 40?0 HV; Semi-hard (1/2H): Tensile strength 240?00 N/mm? Elongation ≥9%, Hardness 55?5 HV; Hard (H): Tensile strength 330?50 N/mm? Hardness 80?50 HV (Other properties customizable)
Compliant Standards	ASTM B36/B36M-01 (USA), JIS H3100:2000 (Japan), DIN-EN 1652:1997 (Germany)
Customization Service	Customizable thickness, width, hardness, and performance parameters

1.1 Core Features

• High Purity & Uniform Quality: Low impurity content with smooth surface, flat sheet shape, and excellent uniformity, ensuring stable performance in batch applications.
• Superior Mechanical Performance: Exceptional flexibility and ductility, paired with strong processability, enabling easy forming, compounding, and various secondary processing.
• Optimal Conductivity: Outstanding electrical and thermal conductivity, meeting high-efficiency transmission and heat dissipation requirements in diverse scenarios.
• Spherical Microstructure: Enhances material toughness and processability, adapting to complex forming needs of high-precision components.
• Global Standard Compliance: Meets mainstream international standards, ensuring compatibility with global manufacturing processes and quality requirements.

2. Product Applications

Endowed with high purity, excellent electrical/thermal conductivity, and superior processability, this product is widely applicable to industrial production and civilian application scenarios. Core applications are as follows:

2.1 Electronic & Electrical Industry

Serves as the core substrate for transformer windings, flexible copper bars, copper-clad laminates (CCL), flexible copper-clad laminates (FCCL), and printed circuit boards (PCB). Its excellent electrical conductivity ensures efficient current transmission, while good flexibility and formability meet the structural design requirements of precision electronic components (compliant with IPC-4562 standard).

2.2 Heat Dissipation & Energy Sector

Applied in geothermal films and heat dissipation components for electronic devices. High thermal conductivity enables rapid heat transfer, ensuring stable equipment operation. It also functions as battery current collectors and other energy storage components, catering to the demands of the new energy industry (e.g., lithium-ion batteries, energy storage systems).

2.3 Architecture & Decoration Field

Suitable for building decorative panels and interior decoration accessories. Its metallic texture and excellent processability allow forming into various decorative shapes via bending, cutting, and other processes, integrating aesthetic appeal and practicality for high-end decoration scenarios.

2.4 Shielding & Connection Applications

Acts as electromagnetic shielding material for electronic devices and communication equipment, effectively blocking electromagnetic interference (EMI). Compatible with various electrical connection components, its low resistance ensures stable and reliable connections in communication base stations, automotive electronics, and other fields.

Note: All performance parameters are tested under standard conditions (20?, 1 atm). For customized specification quotes, material test reports, or sample requests, please contact our sales team.

If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.