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Atomfair 2-inch GaN-on-SiC HEMT Epitaxial Wafer Silicon Carbide (SiC) 2 inch Lattice Mismatch 3.50% Thermal Expansion Difference 25% 5×10 8/cm2
Silicon has long been a key semiconductor for most electronic applications, yet it is less efficient than silicon carbide (SiC) wafers. Now adopted in diverse uses—especially electric vehicles—SiC wafers address energy and cost challenges in developing high-efficiency, high-power devices. Composed of pure silicon and carbon, they outperform silicon in three key aspects: higher critical avalanche breakdown field, greater thermal conductivity, and wider bandgap (3eV). They withstand 8x higher voltage gradients than silicon, have lower high-temperature leakage current, higher current density, thinner structures (1/10 the thickness of silicon epitaxial layers), and lower conduction loss (2x higher doping concentration than silicon).
Description
Specifications | |
---|---|
Substrate Material | Silicon Carbide (SiC) |
Diameter | 2 inch |
Lattice Mismatch | 3.50% |
Thermal Expansion Difference | 25% |
Defect Density | 5×108/cm2 |
Leakage Current | High |
Integration Potential | Medium |
Combines SiC’s excellent thermal conductivity with GaN’s high-frequency and low-loss characteristics. Ideal for RF applications including 5G base stations and defense sector power amplifiers.
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