Atomfair 2-inch GaN-on-Si HEMT Epitaxial Wafer Silicon (Si) 2 inch Lattice Mismatch 16.90% Thermal Expansion Difference 56% 1×10 9/cm2

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As a third-generation semiconductor material, gallium nitride (GaN) features superior bandgap (far higher than silicon and silicon carbide), thermal conductivity, electron mobility, and on-resistance. Due to high N dissociation pressure during GaN growth at high temperatures, large-sized GaN single crystals are hard to obtain—thus, preparing epitaxial GaN films on heterogeneous substrates becomes the main method for GaN material and device research. Common growth methods include HVPE, MBE, and MOCVD. Most commercial devices are based on GaN heteroepitaxy, with SiC, Si, and Sapphire as primary substrates.

SKU: AFMSRDLD950
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Description

Specifications
Substrate Material Silicon (Si)
Diameter 2 inch
Lattice Mismatch 16.90%
Thermal Expansion Difference 56%
Defect Density 1×109/cm2
Leakage Current High
Integration Potential High

Available in both normally-on (D-mode) and normally-off (E-mode) configurations. Compatible with traditional Si processes.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

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