Description

1,1,2,2-Tetrakis(4-glycidoxyphenyl)ethane (CAS No. 7328-97-4) is a high-purity epoxy-functionalized aromatic compound with the molecular formula C₃₈H₃₈O₈. This tetrafunctional glycidyl ether derivative features a central ethane core symmetrically substituted with four glycidoxyphenyl groups, offering exceptional crosslinking potential for advanced polymer applications. Its IUPAC name, 2-[[4-[1,2,2-tris[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane, reflects its complex multi-epoxide structure. This white to off-white crystalline powder exhibits low volatility (MW 622.7 g/mol) and is typically stored at 2-8°C under inert atmosphere to maintain reactivity. With four reactive epoxy groups per molecule, it serves as a premium building block for creating ultra-high-performance epoxy resins, adhesives, and composite matrices. Technical specifications include ≥95% purity (HPLC), <1% water content, and controlled epoxy equivalent weight for precise formulation work. Suitable for research-scale investigations and specialty material development requiring controlled multifunctional crosslinking agents.

Properties

• CAS Number: 7328-97-4
• Complexity: 772
• IUPAC Name: 2-[[4-[1,2,2-tris[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane
• InChI: InChI=1S/C38H38O8/c1-9-29(39-17-33-21-43-33)10-2-25(1)37(26-3-11-30(12-4-26)40-18-34-22-44-34)38(27-5-13-31(14-6-27)41-19-35-23-45-35)28-7-15-32(16-8-28)42-20-36-24-46-36/h1-16,33-38H,17-24H2
• InChI Key: HDDQXUDCEIMISH-UHFFFAOYSA-N
• Exact Mass: 622.25666817
• Molecular Formula: C38H38O8
• Molecular Weight: 622.7
• SMILES: C1C(O1)COC2=CC=C(C=C2)C(C3=CC=C(C=C3)OCC4CO4)C(C5=CC=C(C=C5)OCC6CO6)C7=CC=C(C=C7)OCC8CO8
• Topological: 87
• Monoisotopic Mass: 622.25666817
• Physical Description: Liquid
• Synonyms: 7328-97-4, 1,1,2,2-Tetrakis(4-glycidoxyphenyl)ethane, 4890VLF6RD, DTXSID8029286, DTXCID109286, 1,1,2,2-(4,4′,4”,4”’-Tetraglycidyloxyphenyl)ethane, Oxirane, 2,2′,2”,2”’-(1,2-ethanediylidenetetrakis(4,1-phenyleneoxymethylene))tetrakis-, 1,1,2,2-tetra(p-hydroxyphenyl)ethane tetraglycidyl ether, Ethane, 1,1,2,2-tetrakis(p-(2,3-epoxypropoxy)phenyl)-, Oxirane, 2,2′,2”,2”’-[1,2-ethanediylidenetetrakis(4,1-phenyleneoxymethylene)]tetrakis-, 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane tetraglycidyl ether, 1,1,2,2-TETRAKIS(4-OXYMETHYLENEOXIRANE)PHENYLETHANE, 1,1,2,2-TETRA(4-HYDROXYPHENYL)ETHANE TETRAGLYCIDYL ETHER, 1,1,2,2-TETRAKIS(P-HYDROXYPHENYL)ETHANE TETRAGLYCIDYL ETHER, TETRAGLYCIDYL ETHER OF 1,1,2,2-TETRAKIS(P-HYDROXYPHENYL)ETHANE, 2,2′,2”,2”’-(Ethane-1,2-diylidenetetrakis(p-phenyleneoxymethylene))tetraoxirane, 2,2′,2”,2”’-[ethane-1,2-diylidenetetrakis(p-phenyleneoxymethylene)]tetraoxirane, 2,2′,2”,2”’-(ETHANE-1,1,2,2-TETRAYLTETRAKIS(4,1-PHENYLENEOXYMETHYLENE))TETRAOXIRANE, 2,2′,2”,2”’-[ethane-1,1,2,2-tetrayltetrakis(4,1-phenyleneoxymethylene)]tetraoxirane, TGOPE, 1,1,2,2Tetrakis(4glycidoxyphenyl)ethane, 1,1,2,2Tetrakis(pglycidyloxyphenyl)ethane, Ethane, 1,1,2,2tetrakis(p(2,3epoxypropoxy)phenyl), 1,1,2,2(4,4′,4”,4”’Tetraglycidyloxyphenyl)ethane, 1,1,2,2Tetra(phydroxyphenyl)ethane tetraglycidyl ether, 1,1,2,2Tetrakis(phydroxyphenyl)ethane tetraglycidyl ether, Tetraglycidyl ether of 1,1,2,2tetrakis(phydroxyphenyl)ethane, 2,2′,2”,2”'(Ethane1,2diylidenetetrakis(pphenyleneoxymethylene))tetraoxirane, 1,1,2,2-Tetrakis(p-glycidyloxyphenyl)ethane, 2-[[4-[1,2,2-tris[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane, 1,1,2,2-tetrakis(4-(oxiran-2-ylmethoxy)phenyl)ethane, tetraphenylolethane glycidyl ether, CAS-7328-97-4, 1,1,2,2-Tetrakis[p-glycidyloxyphenyl]ethane, EPON Resin 1031, UNII-4890VLF6RD, Tetraphenylolethane, epichlorohydrin epoxy resin, EINECS 230-820-6, SCHEMBL31450, CHEMBL3182482, HDDQXUDCEIMISH-UHFFFAOYSA-N, Tox21_202150, Tox21_303396, AKOS015912985, NCGC00249177-01, NCGC00257328-01, NCGC00259699-01, FT163897, NS00020346, Q27259130, 1,1,2,2-Tetra(p-hydroxyphenyl)-ethane tetraglycidyl ether

Application

This tetrafunctional epoxy compound is primarily employed as a high-performance crosslinker for aerospace-grade composite matrices and high-temperature adhesives. Researchers utilize it to develop epoxy resin systems with enhanced thermal stability (>300°C) and mechanical properties for advanced material applications. The compound’s symmetrical structure makes it valuable for creating highly crosslinked networks in electronic encapsulants and fiber-reinforced polymers. Specialty applications include formulating next-generation photoresists and as a modifier for improving fracture toughness in epoxy-anhydride systems.

Safety and Hazards

GHS Hazard Statements

• H317: May cause an allergic skin reaction [Warning Sensitization, Skin]
• H341: Suspected of causing genetic defects [Warning Germ cell mutagenicity]

Precautionary Statements

• P203, P261, P272, P280, P302+P352, P318, P321, P333+P317, P362+P364, P405, and P501

Hazard Classes and Categories

• Skin sensitisation – category 1
• Germ cell mutagenicity – category 2

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