Description

1,4-Cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylate) (CAS No. 20249-12-1) is a high-purity epoxy-functionalized compound with the molecular formula C₂₂H₃₂O₆. This specialized chemical features a cyclohexane backbone with dual epoxycyclohexanecarboxylate moieties, making it an excellent crosslinking agent for advanced polymer systems. Its IUPAC name, [4-(7-oxabicyclo[4.1.0]heptane-3-carbonyloxymethyl)cyclohexyl]methyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate, reflects its unique bicyclic epoxy structure. This product is ideal for researchers developing high-performance coatings, adhesives, and composite materials requiring enhanced thermal stability, chemical resistance, and mechanical properties. Available in various quantities with strict quality control to ensure batch-to-batch consistency for your research needs.

Properties

• CAS Number: 20249-12-1
• Complexity: 546
• IUPAC Name: [4-(7-oxabicyclo[4.1.0]heptane-3-carbonyloxymethyl)cyclohexyl]methyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate
• InChI: InChI=1S/C22H32O6/c23-21(15-5-7-17-19(9-15)27-17)25-11-13-1-2-14(4-3-13)12-26-22(24)16-6-8-18-20(10-16)28-18/h13-20H,1-12H2
• InChI Key: NRJLSUZLHMXXHJ-UHFFFAOYSA-N
• Exact Mass: 392.21988874
• Molecular Formula: C22H32O6
• Molecular Weight: 392.5
• SMILES: C1CC(CCC1COC(=O)C2CCC3C(C2)O3)COC(=O)C4CCC5C(C4)O5
• Topological: 77.7
• Monoisotopic Mass: 392.21988874
• Synonyms: 20249-12-1, 1,4-Cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylate), 7-Oxabicyclo[4.1.0]heptane-3-carboxylic acid, 3,3′-[1,4-cyclohexanediylbis(methylene)] ester, [4-(7-oxabicyclo[4.1.0]heptane-3-carbonyloxymethyl)cyclohexyl]methyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate, cyclohexane-1,4-diylbis(methylene) bis(7-oxabicyclo[4.1.0]heptane-3-carboxylate), SCHEMBL681569, NRJLSUZLHMXXHJ-UHFFFAOYSA-N, AKOS015901758

Application

1,4-Cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylate) is primarily used as a reactive diluent and crosslinker in epoxy resin formulations. It enhances the thermal and mechanical properties of coatings and adhesives in aerospace and automotive applications. The compound’s dual epoxy groups enable high crosslink density in polymer networks for improved chemical resistance. Researchers also utilize it in advanced composite materials for electronic encapsulation due to its low shrinkage and excellent adhesion properties.

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