Description
The Parylene F dimer (CAS No. 1785-64-4) is a high-purity fluorinated poly(p-xylylene) precursor with the molecular formula C16H8F8. Its IUPAC name is 5,6,11,12,13,14,15,16-octafluorotricyclo[8.2.2.24,7]hexadeca-1(12),4(16),5,7(15),10,13-hexaene. This advanced specialty chemical is engineered for vapor deposition processes, yielding ultra-thin, conformal Parylene F coatings with exceptional chemical resistance, thermal stability (up to 450°C), and low dielectric constant (k~2.2). The dimer’s unique octafluorinated structure provides enhanced hydrophobicity (contact angle >100°) and UV stability compared to standard Parylene variants. Supplied as white crystalline flakes with ≥99.5% purity (HPLC), it is ideal for critical microelectronic, biomedical, and aerospace applications requiring precision nano-coatings.
Properties
- CAS Number: 1785-64-4
- Complexity: 336
- IUPAC Name: 5,6,11,12,13,14,15,16-octafluorotricyclo[8.2.2.24,7]hexadeca-1(12),4(16),5,7(15),10,13-hexaene
- InChI: InChI=1S/C16H8F8/c17-9-5-1-2-6-11(19)15(23)8(16(24)12(6)20)4-3-7(13(9)21)14(22)10(5)18/h1-4H2
- InChI Key: GUHKMHMGKKRFDT-UHFFFAOYSA-N
- Exact Mass: 352.04982555
- Molecular Formula: C16H8F8
- Molecular Weight: 352.22
- SMILES: C1CC2=C(C(=C(CCC3=C(C(=C1C(=C3F)F)F)F)C(=C2F)F)F)F
- Monoisotopic Mass: 352.04982555
- Synonyms: PARYLENE F DIMER, 1785-64-4, dimer,parylene f, Parylene F, Tricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene, 5,6,11,12,13,14,15,16-octafluoro-, 4,5,7,8,12,13,15,16-Octafluoro[2.2]paracyclophane, MFCD13195584, 5,6,11,12,13,14,15,16-octafluorotricyclo[8.2.2.24,7]hexadeca-1(12),4(16),5,7(15),10,13-hexaene, PARYLENEFDIMER, Octafluor[2.2]paracyclophan, SCHEMBL7461960, DTXSID501338087, BCP25474, AKOS015914609, DS-19889, SY056189, CS-0187601, O0455, C73395, 12,13,15,16,42,43,45,46-Octafluoro-1,4(1,4)-dibenzocyclohexane, 5,6,11,12,13,14,15,16-Octafluorotricyclo[8.2.2.2(4,7)]hexadeca-4,6,10,12,13,15-hexaene
Application
Parylene F dimer is primarily used in chemical vapor deposition (CVD) systems to create ultra-thin, pinhole-free protective coatings for sensitive electronic components. Its fluorinated structure makes it particularly valuable for implantable medical devices requiring biostable insulation with FDA compliance. The material’s exceptional dielectric properties are leveraged in advanced semiconductor packaging and MEMS devices. Additionally, its UV transparency and moisture barrier characteristics are utilized in optical and aerospace applications.
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