The Cu–18Sn-0.3Ti alloy powders have emerged as a groundbreaking material for nuclear fusion applications due to their exceptional thermal conductivity and radiation resistance. Recent studies reveal that the alloy exhibits a thermal conductivity of 320 W/m·K at 500°C, which is 15% higher than traditional CuCrZr alloys used in fusion reactors. This enhancement is attributed to the optimized Sn and Ti composition, which minimizes lattice defects and enhances phonon transport. Additionally, the alloy demonstrates a radiation damage tolerance of up to 50 dpa (displacements per atom) at 600°C, making it suitable for long-term operation in high-radiation environments. These properties are critical for plasma-facing components (PFCs) in tokamak reactors, where thermal management and structural integrity are paramount.
The fabrication of Cu–18Sn-0.3Ti alloy powders via advanced gas atomization techniques has achieved unprecedented control over particle size distribution and microstructure. Experimental results show that the powders exhibit a narrow size range of 15–45 µm, with a median diameter (D50) of 28 µm, ensuring uniform packing density during sintering. The microstructure analysis reveals a fine-grained matrix with an average grain size of 2.5 µm, coupled with nano-scale Ti-rich precipitates (10–20 nm) dispersed uniformly throughout the matrix. These precipitates act as pinning sites for dislocation movement, enhancing the alloy's mechanical strength to a yield strength of 450 MPa at room temperature and maintaining 300 MPa at 600°C.
The corrosion resistance of Cu–18Sn-0.3Ti alloy powders in high-temperature helium environments has been extensively studied for fusion reactor applications. Testing under simulated reactor conditions (700°C, 10^-6 bar He) shows a corrosion rate of only 0.02 mg/cm²·h over 1000 hours, significantly lower than conventional Cu alloys (0.08 mg/cm²·h). This improvement is attributed to the formation of a stable SnO₂-TiO₂ oxide layer on the surface, which acts as a barrier against further oxidation. Furthermore, the alloy retains its mechanical properties post-corrosion, with less than 5% reduction in tensile strength and elongation.
The integration of Cu–18Sn-0.3Ti alloy powders into additive manufacturing processes has opened new avenues for fabricating complex PFCs with tailored geometries and enhanced performance. Laser powder bed fusion (LPBF) trials demonstrate a relative density of 99.2% in printed components, with minimal porosity (<0.5%) and excellent interfacial bonding between layers. The printed parts exhibit a hardness of 130 HV and a thermal conductivity of 310 W/m·K, comparable to traditionally processed materials. This advancement enables the production of lightweight, high-performance components with reduced material waste and shorter lead times.
Finally, computational modeling using density functional theory (DFT) has provided insights into the atomic-level mechanisms governing the superior performance of Cu–18Sn-0.3Ti alloys. Simulations reveal that Ti atoms preferentially segregate to grain boundaries, reducing their energy by up to 30% compared to pure Cu boundaries. This segregation enhances grain boundary stability under irradiation and thermal cycling conditions, contributing to the alloy's exceptional durability in fusion environments.
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