Polymer nanocomposites reinforced with carbon nanotubes (CNTs) or graphene are transforming thermal management in electronics. Recent studies show that CNT-polyimide composites achieve thermal conductivities up to 20 W/m·K at loadings as low as 5 wt%, outperforming traditional thermal interface materials like silicone greases (<5 W/m·K). These composites are being used in high-power LEDs and CPUs to reduce operating temperatures by over 30%.
The alignment of nanofillers using techniques like electric field-assisted assembly further enhances thermal conductivity vertically aligned graphene-epoxy composites exhibit anisotropic thermal conductivities exceeding **50 W/m·K** along the alignment direction while maintaining electrical insulation This makes them ideal for use in printed circuit boards PCBs where heat dissipation is critical
Emerging research focuses on multifunctional nanocomposites that combine thermal management with other properties such as electromagnetic interference EMI shielding For instance graphene-PMMA composites demonstrate EMI shielding effectiveness SE values above **40 dB** while maintaining thermal conductivities above **15 W/m·K** Such materials are being developed for aerospace and automotive applications
The incorporation of phase change materials PCMs into polymer matrices enables passive thermal regulation For example paraffin wax-polyethylene composites exhibit latent heat storage capacities exceeding **150 J/g** while maintaining structural integrity These materials are being explored for use in building insulation and wearable textiles
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