Graphene’s exceptional mechanical properties, including a Young’s modulus of 1 TPa and tensile strength of 130 GPa, make it an ideal candidate for flexible electronics. Recent advancements have demonstrated that graphene-based flexible transistors can achieve carrier mobilities exceeding 10,000 cm²/V·s, outperforming traditional silicon-based devices by an order of magnitude. Moreover, graphene’s atomic thickness (0.34 nm) and transparency (>97.7%) enable ultra-thin, lightweight, and optically transparent electronic components. For instance, graphene-integrated flexible displays have achieved bending radii as low as 1 mm without performance degradation, making them suitable for foldable smartphones and wearable devices.
The integration of graphene with other 2D materials, such as transition metal dichalcogenides (TMDs), has unlocked new functionalities in flexible electronics. Heterostructures combining graphene with MoS₂ have demonstrated on/off current ratios exceeding 10⁸ and subthreshold swings as low as 60 mV/decade, rivaling conventional CMOS technology. These heterostructures also exhibit remarkable mechanical flexibility, with strain tolerance up to 15%, enabling their use in conformable sensors and energy-efficient logic circuits. Recent studies have shown that graphene-MoS₂ photodetectors achieve responsivities of 10⁴ A/W and detectivities of 10¹³ Jones under bending conditions, paving the way for next-generation optoelectronic systems.
Graphene-based materials are revolutionizing energy storage in flexible electronics by enabling high-capacity, lightweight supercapacitors and batteries. Flexible graphene supercapacitors have achieved specific capacitances of up to 550 F/g at scan rates of 100 mV/s, with energy densities exceeding 80 Wh/kg. These devices retain over 95% of their capacitance after 10,000 charge-discharge cycles under mechanical deformation. Similarly, graphene-enhanced lithium-ion batteries exhibit capacities of ~1,000 mAh/g at C-rates of 0.5C, with flexibility maintained at bending angles up to 180°. Such advancements are critical for powering wearable devices and Internet-of-Things (IoT) applications.
The development of scalable fabrication techniques for graphene-based flexible electronics has accelerated their commercialization. Roll-to-roll (R2R) production methods now enable the continuous synthesis of high-quality graphene films with sheet resistances as low as 30 Ω/sq and transparencies above 90%. These films are being integrated into touchscreens with response times <10 ms and multi-touch capabilities exceeding 10 points simultaneously. Additionally, inkjet printing of graphene inks has achieved feature resolutions below 20 µm, facilitating the mass production of flexible circuits and sensors at reduced costs.
Graphene’s unique thermal properties are being harnessed to address heat dissipation challenges in flexible electronics. Graphene-based thermal interface materials (TIMs) exhibit thermal conductivities exceeding 5,000 W/m·K at room temperature, significantly outperforming conventional TIMs (~5 W/m·K). This enables efficient heat management in high-power flexible devices such as foldable OLED displays and stretchable processors. Recent prototypes have demonstrated temperature reductions by up to 15°C in operating conditions while maintaining flexibility over thousands of bending cycles.
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