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Atomfair Diphenyldiethoxysilane C16H20O2Si

Description Diphenyldiethoxysilane (CAS No. 2553-19-7) is a high-purity organosilicon compound with the molecular formula C16H20O2Si and IUPAC name diethoxy(diphenyl)silane . This versatile silane reagent features two ethoxy groups and two phenyl groups bonded to a central silicon atom, making it an excellent precursor for surface modification, polymer synthesis, and sol-gel chemistry. With a molecular weight of 272.42 g/mol, it is a clear, colorless to pale yellow liquid under standard conditions. Ideal for research and industrial applications, our Diphenyldiethoxysilane is rigorously tested to ensure ??98% purity (GC) and is packaged under inert gas to maintain stability. Suitable for use as a…

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Description

Description

Diphenyldiethoxysilane (CAS No. 2553-19-7) is a high-purity organosilicon compound with the molecular formula C16H20O2Si and IUPAC name diethoxy(diphenyl)silane. This versatile silane reagent features two ethoxy groups and two phenyl groups bonded to a central silicon atom, making it an excellent precursor for surface modification, polymer synthesis, and sol-gel chemistry. With a molecular weight of 272.42 g/mol, it is a clear, colorless to pale yellow liquid under standard conditions. Ideal for research and industrial applications, our Diphenyldiethoxysilane is rigorously tested to ensure ??98% purity (GC) and is packaged under inert gas to maintain stability. Suitable for use as a coupling agent, crosslinker, or hydrophobic coating component in advanced material science, electronics, and nanotechnology applications.

  • CAS No: 2553-19-7
  • Molecular Formula: C16H20O2Si
  • Molecular Weight: 272.41
  • Exact Mass: 272.123256411
  • Monoisotopic Mass: 272.123256411
  • IUPAC Name: diethoxy(diphenyl)silane
  • SMILES: CCO[Si](C1=CC=CC=C1)(C2=CC=CC=C2)OCC
  • Synonyms: Diethoxydiphenylsilane, 2553-19-7, Diphenyldiethoxysilane, Silane, diethoxydiphenyl-, 2L8R5QPV9A

Application

Diphenyldiethoxysilane is widely used as a surface modifier to enhance the adhesion and hydrophobicity of glass, metals, and polymers. In sol-gel processes, it serves as a key precursor for synthesizing hybrid organic-inorganic materials with tailored mechanical and thermal properties. The compound is also employed in the production of silicone resins and as a crosslinking agent in silicone rubber formulations.

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