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Atomfair Double-Layer Flexible Copper Clad Laminate (2L FCCL) – International Product Specification

Product Overview

Atomfair Double-Layer Flexible Copper Clad Laminate (2L FCCL) is precision-engineered by bonding high-quality copper foil with polyimide (PI) film. It delivers exceptional electrical conductivity, superior thermal stability, and long-term durability, maintaining consistent performance even in high-temperature and harsh operating environments.
With outstanding flexibility and processability, the product adapts seamlessly to complex circuit designs, providing reliable electrical performance and an extended service life for a wide range of electronic devices. It fully complies with international standards including IPC, UL, and RoHS, making it a trusted choice for global customers.

Product Specifications

Product Model
Copper Foil Type
Structure
MG2DB1003EH
ED (Electrodeposited), 1/3 oz
1.0mil TPI + 1/3 oz Copper Foil
MG2DB1005EH
ED (Electrodeposited), 1/2 oz
1.0mil TPI + 1/2 oz Copper Foil
MG2DF0803ER
ED (Electrodeposited), 1/3 oz
0.8mil TPI + 1/3 oz Copper Foil
MG2DF1003ER
ED (Electrodeposited), 1/3 oz
1.0mil TPI + 1/3 oz Copper Foil
MG2DF1005ER
ED (Electrodeposited), 1/2 oz
1.0mil TPI + 1/2 oz Copper Foil
MG2DF1003RF
RA (Rolled Annealed), 1/3 oz
1.0mil TPI + 1/3 oz Copper Foil
MG2DF1005RF
RA (Rolled Annealed), 1/2 oz
1.0mil TPI + 1/2 oz Copper Foil
Note: ED copper foil offers excellent conductivity for general applications; RA copper foil provides superior flexibility for high-bending scenarios.

Core Product Performance

  • Lightweight & Compact: Boasts a slim structure and low weight, perfectly aligning with the miniaturization and lightweight design trends of modern electronic devices.
  • Exceptional Flexibility: Exhibits outstanding bending and folding resistance, maintaining performance integrity after repeated deformations. Ideal for electronic products with complex shapes and movable components (e.g., wearable devices).
  • Superior Electrical Performance: Low dielectric constant (DK) enables high-speed signal transmission, minimizing signal delay and loss—an optimal choice for high-frequency applications such as 5G communication devices.
  • Strong Thermal Stability: Excellent thermal conductivity facilitates rapid heat dissipation, ensuring stable operation of electronic components in high-temperature environments (tested per IPC-TM-650 2.4.25).
  • High-Temperature Resistance: High glass transition temperature (Tg) preserves excellent mechanical and electrical properties under high-temperature conditions, suitable for automotive electronics and industrial control systems.
  • Reliable Durability: Stable chemical and physical properties prevent performance degradation during long-term use, providing a durable solution for critical electronic applications.
  • Automation-Ready: Supplied in continuous roll form, supporting automated continuous production processes, improving production efficiency, and reducing manufacturing costs.

Application Fields

  • Rigid-Flex PCBs: Serves as the core material for rigid-flex printed circuit boards, integrating the adaptability of flexible circuits with the mechanical strength of rigid boards to meet compact design requirements for complex electronic devices (e.g., aerospace electronics).
  • Chip on Film (COF): Applied in chip direct packaging technology, widely used in space-constrained electronic products such as display panels and camera modules.
  • Flexible Printed Circuits (FPCs): A key base material for FPCs, extensively used in mobile phones, wearable devices, medical instruments, and other products requiring high lightweight and flexibility standards.
  • High-Frequency Communication Equipment: Utilized in manufacturing core components like antennas for high-frequency communication devices, ensuring superior communication quality thanks to its excellent electrical performance.
  • Automotive Electronics: Suitable for connecting complex electronic modules in automotive systems, particularly meeting flexible connection requirements in high-temperature engine compartments, enhancing the stability and reliability of automotive electronics.

Quality Assurance & Certifications

Atomfair implements strict quality control throughout the 2L FCCL production process, covering raw material inspection (copper foil purity, PI film performance), in-process monitoring (bonding strength, thickness uniformity), and finished product testing (electrical conductivity, flexibility, thermal resistance).
The product has obtained multiple international certifications, including: UL Certification (UL94 V-0 flame retardancy), RoHS Compliance Certification (2011/65/EU), and ISO 9001 Quality Management System Certification, ensuring consistent quality and compliance with global market regulations.
If you’re interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
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